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Erwin Meinders
Meinders Erwin R, Mijiritskii Andrei: Writable optical recording medium. Koninklijke Philips Electronics, Meinders Erwin R, Mijiritskii Andrei, UITTENBOGAARD Frank, September 30, 2004: WO/2004/084205 (2 worldwide citation)

The present invention relates to a writable optical recording medium (500), and in particular to a write-once optical record carrier comprising a substrate (520) carrying a recording stack (510) which recording stack comprises a recording layer (516), made of PEDOT and/or derivatives thereof.


32
Erwin Meinders
Mijiritskii Andrei, Meinders Erwin R: Label on laser entry side of an optical disc. Koninklijke Philips Electronics, Mijiritskii Andrei, Meinders Erwin R, UITTENBOGAARD Frank, September 9, 2005: WO/2005/083712 (2 worldwide citation)

An optical disc (3) for storing data is provided with a label material layer (8) on a laser entry side of the disc (3). The label material layer (8) does not impede reading data from or writing data onto the disc (3). Reflection or absorption of light in the visual spectrum by the label material in ...


33

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Erwin Meinders
Diederiks Elmo M A, Meinders Erwin R, Van, Lier Edwin, Peters Ralph H: Method of and system for controlling an ambient light and lighting unit. Koninklijke Philips Electronics, Diederiks Elmo M A, Meinders Erwin R, Van, Lier Edwin, Peters Ralph H, GROENENDAAL Antonius W M, January 15, 2004: WO/2004/006578 (2 worldwide citation)

The invention relates to the on-line analysis of meta-data that is received together with a video signal. This analysis results in an adaptation of the lighting surrounding the presentation device (110). One or more characteristics of the meta-data are filtered out and translated into lighting setti ...


35
Belgacem Haba Belgacem (Bel) Haba
Joseph C Fjelstad, Para K Segaram, Belgacem Haba: Direct-connect signaling system. Samsung Electronics, Myers Bigel Sibley & Sajovec P A, August 2, 2011: US07989929 (1 worldwide citation)

A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages suspended above the printed circuit bo ...


36
David Sherrer
David W Sherrer, Mindaugas F Dautartas, Neil Ricks, Dan A Steinberg: Optical device package. Samsung Electronics, Sughrue Mion PLLC, March 19, 2013: US08399897 (1 worldwide citation)

An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a li ...


37
Erwin Meinders
Erwin Rinaldo Meinders, Hermanus Johannes Borg, Guo Fu Zhou, Johannes Cornelis Norbertus Rijpers: Multi-stack optical data storage medium and use of such a medium. Koninklijke Philips Electronics, Michael E Belk, May 6, 2008: US07368223 (1 worldwide citation)

A multi-stack optical data storage medium for rewritable recording by a focused laser-light beam, the medium having a substrate with deposited on aside thereof: a first recording stack comprising a phase-change type recording layer at least one further recording stack comprising a phase-change type ...


38
Erwin Meinders
Hubert Cécile François Martens, Erwin Rinaldo Meinders: Apparatus and method for recording an information on a recordable optical record carrier using oval spot profile. Koninklijke Philips Electronics, July 8, 2008: US07397734 (1 worldwide citation)

A method and a corresponding apparatus for recording an information on a recordable optical record carrier (2) by irradiation of a light beam through an optical system (3-7) onto said record carrier (2) for forming marks and lands representing said information along an information recording directio ...


39
Percy Chinoy
Yoginder Anand, Percy Bomi Chinoy: Reduced parasitic capacitance semiconductor devices. Tyco Electronics, October 30, 2001: US06310394 (1 worldwide citation)

Semiconductor devices comprise a substrate having a semiconductor disposed thereon with a layer of dielectric material, less than 10 microns thick, disposed about the semiconductor; the dielectric layer has a bond pad disposed on its upper surface a via lined with an electrically conductive material ...


40
Erwin Meinders
Martinus Bernardus Van Der Mark, Erwin Rinaldo Meinders: Multi-stack rolled-up information carrier. Koninklijke Philips Electronics, April 10, 2007: US07203152 (1 worldwide citation)

The invention relates to an information carrier for scanning information by means of an optical beam having a wave-length. The information carrier comprises a central hole (11) and at least two information stacks (13, 14) rolled up around said hole. Each information stack comprises a first electrode ...



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