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Morris Anschel, Bahgat G Sammakia: Electronic package with heat spreader member. International Business Machines Corporation, Lawrence R Fraley, April 3, 1990: US04914551 (111 worldwide citation)

An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention ...


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Anschel Morris, Sammakia Bahgat Ghaleb: Electronic package with heat spreader member.. Ibm, January 17, 1990: EP0350593-A2 (9 worldwide citation)

An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention ...


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Sammakia Bahgat G, Anschel Morris: Boitier de module electronique a element de dissipation de chaleur, Electronic package with heat spreader member. International Business Machines Corporation, SAUNDERS RAYMOND H, August 20, 1991: CA1287929

ABSTRACT An electronic package (10) including a first circuitizedsubstrate 11 (e.g., printed circuit board) having connected thereto asecond, flexible circuitized substrate (e.g., polyimide withchrcme-copper-chrome circuitry thereon). The second substrate is inturn electrically connected to the inve ...


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