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Vrtis Joan, Figueroa David, Kohmura Toshimi, Walk Michael, Hale Aaron: Electronic package having embedded capacitors and method of fabrication therefor. Intel, November 12, 2003: EP1360721-A2

An electronic package (302, Figure 3) includes one or more capacitors (308) embedded within one or more layers (310) of the package. The embedded capacitors are discrete devices, such as integrated circuit capacitors (Figures 17-18) or ceramic capacitors. During the package build-up process, the cap ...


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Vrtis Joan, Figueroa David, Kohmura Toshimi, Walk Michael, Hale Aaron: Electronic package having embedded capacitors and method of fabrication therefor. Intel Corporation, Vrtis Joan, Figueroa David, Kohmura Toshimi, Walk Michael, Hale Aaron, VIKSNINS Ann S, January 10, 2002: WO/2002/003463

An electronic package (302, Figure 3) includes one or more capacitors (308) embedded within one or more layers (310) of the package. The embedded capacitors are discrete devices, such as integrated circuit capacitors (Figures 17-18) or ceramic capacitors. During the package build-up process, the cap ...


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Kohmura Toshimi, Figueroa David, Hale Aaron: Electronic package having embedded capacitors and method of fabrication therefor. Intel, chen jingjun liang yong, January 14, 2004: CN01811834

An electronic package (302, Figure 3) includes one or more capacitors (308) embedded within one or more layers (310) of the package. The embedded capacitors are discrete devices, such as integrated circuit capacitors (Figures 17-18) or ceramic capacitors. During the package build-up process, the cap ...


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