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David Sherrer
James W Getz, David W Sherrer, John J Fisher: Electronic device packages and methods of formation. Samsung Electronics, Sughrue Mion PLLC, June 19, 2012: US08203207 (34 worldwide citation)

Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for he ...


2
David Sherrer
James W Getz, David W Sherrer, John J Fisher: Electronic device packages and methods of formation. Rohm and Haas Electronic Materials, Jonathan D Baskin, Rohm and Haas Electronic Materials, October 15, 2009: US20090256251-A1

Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for he ...


3
Sherrer David, Getz James W, Fisher John J: Electronic device packages and methods of formation. Rohm &Amp, Haas Elect Materials, August 27, 2008: EP1962344-A1

Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for he ...


4
Sherrer David, Getz James W, Fisher John J: Electronic device packages and methods of formation. Rohm &Amp Haas Elect Materials, gumin, September 10, 2008: CN200810096308

Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for he ...


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