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Bernd Goller, Gerald Ofner, Josef Thumbs, Holger Wörner, Robert Christian Hagen, Christian Stümpfl, Stefan Wein: Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, March 23, 2004: US06710455 (28 worldwide citation)

An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate ...


2
Bernd Goller, Gerald Ofner, Josef Thumbs, Holger Worner, Robert Christian Hagen, Christian Stumpfl, Stefan Wein: Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component. Lerner And Greenberg Pa, March 13, 2003: US20030047813-A1

An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate ...



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