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Michael Bauer, Peter Strobel, Gerald Ofner, Edward F├╝rgut, Simon Jerebic, Thomas Bemmerl, Markus Fink, Hermann Vilsmeier: Electronic component and semiconductor wafer, and method for producing the same. Infineon Technologies, Dicke Billig Czaja PLLC, September 2, 2008: US07420262 (20 worldwide citation)

The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semicond ...


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Michael Bauer, Peter Strobel, Gerald Ofner, Edward Furgut, Simon Jerebic, Thomas Bemmerl, Markus Fink, Hermann Vilsmeier: Electronic component and semiconductor wafer, and method for producing the same. Infineon Technologies, Dicke Billig & Czaja PLLC, October 21, 2004: US20040207049-A1

The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semicond ...



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