1
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, November 5, 2002: US06475896 (44 worldwide citation)

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (


2
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, May 4, 2004: US06730589 (12 worldwide citation)

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (


3
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, December 30, 2008: US07470979 (7 worldwide citation)

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providin ...


4
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, May 23, 2006: US07049686 (7 worldwide citation)

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providin ...


5
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, March 31, 2009: US07511362 (4 worldwide citation)

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is a step of forming electrodes (12) on a wafer (10); a step of providing ...


6
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, November 30, 2010: US07842598 (1 worldwide citation)

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providin ...


7
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, February 14, 2012: US08115284

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes on a wafer; a step of providing a resin ...


8
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, May 22, 2003: US20030096449-A1

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providin ...


9
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, September 16, 2004: US20040180486-A1

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providin ...


10
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, June 22, 2006: US20060131705-A1

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providin ...



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