1
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, October 12, 2004: US06803663 (31 worldwide citation)

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (


2
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, January 24, 2006: US06989605 (13 worldwide citation)

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


3
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, October 6, 2009: US07598619 (2 worldwide citation)

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


4
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, October 10, 2006: US07119445 (1 worldwide citation)

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


5
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, June 26, 2003: US20030116859-A1 (1 worldwide citation)

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


6
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, April 26, 2011: US07932612

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device having a semiconductor c ...


7
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, March 13, 2012: US08134237

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device having a semiconductor c ...


8
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, October 14, 2008: US07436071

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


9
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, December 21, 2006: US20060284320-A1

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


10
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, February 3, 2005: US20050023652-A1

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...



Click the thumbnails below to visualize the patent trend.