1
Nobuaki Hashimoto: Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board. Seiko Epson Corporation, Oliff & Berridge, February 4, 2003: US06515370 (25 worldwide citation)

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (


2
Nobuaki Hashimoto: Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board. Oliff & Berridge, February 28, 2002: US20020024124-A1

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


3
Hashimoto Nobuaki: Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board. Seiko Epson Corporation, Hashimoto Nobuaki, INOUE Hajime, September 17, 1998: WO/1998/040915

An assembled-type semiconductor device which enables reduction in cost or improvement in reliability in junction between chips or between a chip and a circuit board. This assembled-type semiconductor device has a first semiconductor device (10) including a semiconductor chip (12) having an electrode ...


4
Hashimoto Nobuaki: Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board. Seiko Epson Corporation, February 25, 2000: KR1019980708849

PURPOSE: An assembled-type semiconductor device enables reduction in cost or improvement in reliability in junction between chips or between a chip and a circuit board. CONSTITUTION: The assembled-type semiconductor device comprises a first semiconductor device (10) including a semiconductor chip (1 ...


5
Hashimoto Nobuaki: Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board. Seiko Epson Corporation, March 14, 2005: KR1020057001622

An assembled-type semiconductor device which enables reduction in cost or improvement in reliability in junction between chips or between a chip and a circuit board. This assembled-type semiconductor device has a first semiconductor device (10) including a semiconductor chip (12) having an electrode ...



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