61
Nishimura Takao, Kumagai Kinichi: Wiring board, packaging structure of electronic component, and semiconductor device. Fujitsu, October 2, 2008: JP2008-235365

PROBLEM TO BE SOLVED: To provide a wiring board having a structure capable of allowing an adhesive to flow in easily, suppressing the formation of bubbles near the edge of an opening, and easily discharging the bubbles, when allowing the adhesive to flow into the opening of an insulation resin film ...


62
Hagiwara Shinsuke, Saito Hiroyuki, Kojima Hiroki, Peter Huber, Runbart Deutsch, Michael Gekku: Epoxy resin molding material for sealing electronic component and semiconductor device sealed therewith. Hitachi Chem, Wacker Chemie, May 28, 1996: JP1996-134179

PURPOSE: To provide the subject material which contains specifically structured microparticles of a silicone compound having specified units and can give articles excellent in reliability such as heat shock resistance, reflow crack resistance, heat resistance, and humidity resistance. CONSTITUTION: ...


63
Usui Yasuhiro, Fukusono Kenji, Toyabe Yoko: Structure for cooling electronic component and semiconductor module. Fujitsu, September 9, 2004: JP2004-253522

PROBLEM TO BE SOLVED: To provide a structure for cooling electronic component and a semiconductor module which can improve reliability by relaxing stress to be applied to each portion when a plastic substrate is used, and equalizing height of solder between electronic component and cooling component ...


64
Honda Naomi: Adhesive sheet for electronic component, and semiconductor device using the same. Mitsubishi Electric, August 22, 2003: JP2003-234360

PROBLEM TO BE SOLVED: To provide an adhesive sheet for electronic component which, when an electronic component is bonded to a mount base or to another laminated electronic component using the adhesive sheet, can prevent the formation of a raised part on the surface of the electronic component cause ...


65
Noguchi Takashi, Machida Masahiro, Terui Makoto, Ideushi Yuichi: Electronic component and semiconductor device. Oki Electric, September 14, 2006: JP2006-245599

PROBLEM TO BE SOLVED: To provide an electronic component such as a chip from which heat can be dissipated efficiently to the outside, and to provide a semiconductor device where an electronic component is mounted on a substrate for mounting an electronic component.SOLUTION: The electronic component ...


66
Hashimoto Nobuaki: Electronic component and semiconductor device. Seiko Epson, March 30, 2006: JP2006-086541

PROBLEM TO BE SOLVED: To provide an electronic component and a semiconductor device that are capable of reducing cost or improving reliability in connecting chips together or chips to a circuit board as well as a method of fabricating the same, and further a circuit board having the same mounted the ...


67
Matsuki Hirohisa, Ikumo Masamitsu, Okamoto Hisahiro: Method of manufacturing semiconductor device and semiconductor electronic component, and semiconductor electronic component. Fujitsu, September 30, 2004: JP2004-273604

PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device which can manufacture thin film semiconductor devices in a high manufacturing yield.SOLUTION: The method of manufacturing semiconductor device includes a process (a) to form a resin layer showing a first adhesive force t ...


68
Hashimoto Nobuaki: Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board. Seiko Epson Corporation, February 25, 2000: KR1019980708849

PURPOSE: An assembled-type semiconductor device enables reduction in cost or improvement in reliability in junction between chips or between a chip and a circuit board. CONSTITUTION: The assembled-type semiconductor device comprises a first semiconductor device (10) including a semiconductor chip (1 ...


69
Hashimoto Nobuaki: Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment. Seiko Epson Corporation, June 29, 2005: KR1020057010294

A semiconductor device whose package size is nearly the same as the size of a chip, which has a stress absorbing layer, which does not require a flexible substrate, and which can be manufactured in a large number at the same time. A method for manufacturing a semiconductor device includes a process ...


70
Yamamoto Masahiko, Kouzan Yoshihiro, Noto Sachio, Kobayashi Kiyohito: Inspection apparatus and method for film carrier tape for mounting electronic component and semiconductor device, using magnifying lens with various magnification ratios. Mitsui Mining &Amp Amp Smelting, May 12, 2006: KR1020050013732

PURPOSE: An inspection apparatus and a method for inspecting a film carrier tape for mounting an electronic component and a semiconductor device are provided to enhance user convenience by enabling the user to inspect the film carrier tape while the user is seated naturally. CONSTITUTION: An inspect ...



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