51
Hashimoto Nobuaki: Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board. Seiko Epson Corporation, Hashimoto Nobuaki, INOUE Hajime, September 17, 1998: WO/1998/040915

An assembled-type semiconductor device which enables reduction in cost or improvement in reliability in junction between chips or between a chip and a circuit board. This assembled-type semiconductor device has a first semiconductor device (10) including a semiconductor chip (12) having an electrode ...


52
Pour Siamak Fazel: Leadframe having a paddle with an isolated area and a single paddle having a semiconductor device and a passive electronic component. Conexant Systems, sTAKAHASHI Mark M, November 11, 1999: WO/1999/057763

A package and a corresponding method of forming this package is provided for surface mounting the semiconductor device to a board such that a first pad of the semiconductor device is operatively connected to a second pad on the board. The package includes a paddle having a front side and a back side ...


53
Kimbara Masahiko: (Ja) 電子部品の実装方法及び実装装置、並びに半導体装置の製造方法, (En) Method and apparatus for mounting electronic component and semiconductor device manufacturing method. Kabushiki Kaisha Toyota Jidoshokki, Kimbara Masahiko, ONDA Hironori, September 7, 2007: WO/2007/099873

(EN) Provided is a method for mounting semiconductor elements at a plurality of mounting positions on the front plane of a circuit board, respectively, through a solder. A plurality of pairs of semiconductor elements, i.e., at least a part of the semiconductor elements to be mounted on the circuit b ...


54
Hashimoto Nobuaki: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson, Liu Zongjie, Wang Xiaoheng, July 22, 2009: CN200910004418

The invention relate to a semiconductor device, a method for manufacture thereof, a circuit board, and an electronic equipment. The semiconductor device (150) with a package size close to its chip size, apart from a stress absorbing layer, capable of effectively absorbing thermal stresses has a semi ...


55
Katsurayama Satoru, Yamashiro Tomoe, Hirano Takashi: Semiconductor electronic component and semiconductor device using the same. Sumitomo Bakelite Co, Guan Xincheng, September 9, 2009: CN200780040480

The present invention discloses a chip-on-chip type semiconductor electronic component and a semiconductor device which can meet the requirements for further density increase of semiconductor integrated circuits. The present invention provides: a chip-on-chip type semiconductor electronic component ...


56
Aoyama Hiroshi: Method for manufacturing electronic component and semiconductor device. Hallys, October 23, 2008: JP2008-257420

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component for efficiently manufacturing an electronic component where a semiconductor device is mounted on the surface of a sheet base material, and to provide a semiconductor device suitable for the method for manufacturing t ...


57
Hashimoto Nobuaki: Electronic component and semiconductor device. Seiko Epson, February 5, 2009: JP2009-027185

PROBLEM TO BE SOLVED: To provide an electronic component and a semiconductor device which can mitigate a thermal stress for not disconnecting a wiring, a manufacturing method thereof, a circuit board packaging these, and an electronic apparatus having this circuit board.SOLUTION: The semiconductor d ...


58
Hashimoto Nobuaki: Electronic component and semiconductor device, and manufacturing method thereof. Seiko Epson, January 15, 2009: JP2009-010436

PROBLEM TO BE SOLVED: To provide an electronic component and a semiconductor device that are capable of reducing cost or improving the reliability of connecting chips together or chips to a circuit board, manufacturing methods of them, a circuit board mounted with them, and electronic equipment havi ...


59
Hayashi Katsuhiko: Electronic component and semiconductor device. TDK, May 17, 2007: JP2007-123504

PROBLEM TO BE SOLVED: To provide an electronic component to be held between a package substrate and an IC chip, having a structure capable of evading dielectric coupling between signal terminals and reducing a waveform distortion, and to provide a semiconductor device using the component.SOLUTION: A ...


60
Nishimoto Masaharu, Kawano Takayuki, Arao Osamu: Epoxy resin composition for protecting electronic component, and semiconductor device using the same. Somar, Denso, October 19, 2006: JP2006-282824

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for protecting an electronic component, having excellent moisture resistance under superimposed voltage and heat-cycle resistance, further having good properties of intruding into a gap, and hardly causing repelling caused by flux residue o ...



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