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Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, May 11, 2006: US20060097369-A1

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is a step of forming electrodes (12) on a wafer (10); a step of providing ...


42
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument. Seiko Epson Corporation, April 28, 2011: US20110095432-A1

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes on a wafer; a step of providing a resin ...


43
Satoru Katsurayama, Tomoe Yamashiro, Takashi Hirano: Semiconductor electronic component and semiconductor device using the same. Ditthavong Mori & Steiner PC, April 29, 2010: US20100102446-A1

The problem of the present invention is to provide a chip-on-chip type semiconductor electronic component and a semiconductor device which can meet the requirements for further density increase of semiconductor integrated circuits.The present invention provides: a chip-on-chip type semiconductor ele ...


44
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, July 16, 2009: US20090181521-A1

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providin ...


45
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, January 29, 2009: US20090026631-A1

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


46
Nobuaki HASHIMOTO: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, October 28, 2010: US20100273311-A1

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providin ...


47
Nobuaki HASHIMOTO: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, December 10, 2009: US20090302467-A1

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device having a semiconductor c ...


48
Kenzou Maejima, Satoru Katsurayama: Adhesive film, multilayer circuit board, electronic component and semiconductor device. Sumitomo Bakelite, June 21, 2012: US20120156502-A1

Disclosed is an adhesive film in which the adhesive film contains a thermosetting resin (A), a curing agent (B), a compound having flux activity (C) and a film forming resin (D), the minimum melt viscosity of the adhesive film is 0.01 to 10,000 Pa┬Ěs, and the adhesive film satisfies the following for ...


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Nobuaki HASHIMOTO: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, July 28, 2011: US20110180927-A1

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device having a semiconductor c ...


50
Hashimoto Nobuaki: Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment. Seiko Epson Corporation, Hashimoto Nobuaki, INOUE Hajime, June 11, 1998: WO/1998/025297

A semiconductor device whose package size is nearly the same as the size of a chip, which has a stress absorbing layer, which does not require a flexible substrate, and which can be manufactured in a large number at the same time. A method for manufacturing a semiconductor device includes a process ...



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