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Tanaka Masakazu: Package for electronic component and semiconductor device using the same. NEC Electronics, January 19, 2006: JP2006-019338 (1 worldwide citation)

PROBLEM TO BE SOLVED: To provide a package for an electronic component which can be prevented from defective packaging and destruction, even if a semiconductor chip having a size smaller than the maximum mounting size is mounted, and to provide a semiconductor device using the same.SOLUTION: The pac ...


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Mayahara Yoshio: Semiconductor sealing glass, semiconductor electronic component and semiconductor sealing glass ceramic. Nippon Electric Glass, May 29, 2008: JP2008-120648 (1 worldwide citation)

PROBLEM TO BE SOLVED: To provide a semiconductor sealing glass ceramic which is friendly to environment and by which a semiconductor electronic component having ≥1,000°C heat resistance in regular use is obtained and the semiconductor electronic component.SOLUTION: The semiconductor sealing glass is ...


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MAEJIMA KENZOU: 接着フィルム、多層回路基板、電子部品及び半導体装置 (JA), Adhesive film, multilayer circuit board, electronic component, and semiconductor device (EN). Sumitomo Bakelite, Hayami Shinji, March 24, 2011: WO/2011/033743 (1 worldwide citation)

Disclosed is an adhesive film having a composition containing (A) a thermosetting resin, (B) a hardening agent, (C) a flux activation compound, and (D) a film forming resin. The adhesive film has a minimum melt viscosity of 0.01-10,000 Pa·s and satisfies formula (1), where the exothermic peak temper ...


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Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, February 14, 2012: US08115284

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes on a wafer; a step of providing a resin ...


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Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, April 26, 2011: US07932612

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device having a semiconductor c ...


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Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, March 13, 2012: US08134237

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device having a semiconductor c ...


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Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, October 14, 2008: US07436071

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


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Hashimoto Nobuaki: Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment. Seiko Epson, jiang fuhou, March 10, 1999: CN97192032

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providin ...



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