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Hashimoto Nobuaki: Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment. Seiko Epson, March 21, 2002: TW480636 (1 worldwide citation)

The present invention relates to an electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment, in which the package size is nearly the same as the size of a chip, and the component has a stress absorbing layer to eliminat ...


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Tanaka Masakazu: Package for electronic component and semiconductor device using the same. NEC Electronics, January 19, 2006: JP2006-019338 (1 worldwide citation)

PROBLEM TO BE SOLVED: To provide a package for an electronic component which can be prevented from defective packaging and destruction, even if a semiconductor chip having a size smaller than the maximum mounting size is mounted, and to provide a semiconductor device using the same.SOLUTION: The pac ...


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Mayahara Yoshio: Semiconductor sealing glass, semiconductor electronic component and semiconductor sealing glass ceramic. Nippon Electric Glass, May 29, 2008: JP2008-120648 (1 worldwide citation)

PROBLEM TO BE SOLVED: To provide a semiconductor sealing glass ceramic which is friendly to environment and by which a semiconductor electronic component having ≥1,000°C heat resistance in regular use is obtained and the semiconductor electronic component.SOLUTION: The semiconductor sealing glass is ...


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Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, February 14, 2012: US08115284

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes on a wafer; a step of providing a resin ...


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Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, April 26, 2011: US07932612

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device having a semiconductor c ...


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Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, March 13, 2012: US08134237

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device having a semiconductor c ...


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Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, October 14, 2008: US07436071

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


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Hashimoto Nobuaki: Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment. Seiko Epson, jiang fuhou, March 10, 1999: CN97192032

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providin ...



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