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Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, March 31, 2009: US07511362 (4 worldwide citation)

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is a step of forming electrodes (12) on a wafer (10); a step of providing ...


12
Himeno Yuji: Packaging of electronic component and semiconductor device. Sony, June 23, 2000: JP2000-174442 (3 worldwide citation)

PROBLEM TO BE SOLVED: To provide a reliable and economic method of packaging an electronic component even if a semicondutor element is buried in an insulated layer of a multilayer electronic circuit board by allowing part of the insulation layer to serve for a sealing section of the semiconductor el ...


13
Katsurayama Satoru, Yamashiro Tomoe, Hirano Takashi: Semiconductor electronic component and semiconductor device using the same. Sumitomo Bakelite, Katsurayama Satoru, Yamashiro Tomoe, Hirano Takashi, KOBAYASHI Hiroshi, May 8, 2008: WO/2008/054011 (3 worldwide citation)

A chip-on-chip type semiconductor electronic component which meets requirement of further density increase of semiconductor integrated circuits is provided. A semiconductor device is also provided. In the chip-on-chip type semiconductor electronic component, the circuit surface of a first semiconduc ...


14
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, October 6, 2009: US07598619 (2 worldwide citation)

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


15
Nakamura Toshinobu, Chinda Satoshi: Lead material for electronic component and semiconductor device using the same. Hitachi Cable, September 21, 2001: JP2001-257303 (2 worldwide citation)

PROBLEM TO BE SOLVED: To provide a lead material for electronic components which will not cause the problem of an environment contamination with lead.SOLUTION: The surface of the lead material 1 made of copper, its alloy, iron, its alloy, or the like is coated with a tin-copper alloy plating layer 2 ...


16
MAEJIMA KENZOU: 接着フィルム、多層回路基板、電子部品及び半導体装置 (JA), Adhesive film, multilayer circuit board, electronic component, and semiconductor device (EN). Sumitomo Bakelite, Hayami Shinji, March 24, 2011: WO/2011/033743 (2 worldwide citation)

Disclosed is an adhesive film having a composition containing (A) a thermosetting resin, (B) a hardening agent, (C) a flux activation compound, and (D) a film forming resin. The adhesive film has a minimum melt viscosity of 0.01-10,000 Pa·s and satisfies formula (1), where the exothermic peak temper ...


17
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, November 30, 2010: US07842598 (1 worldwide citation)

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providin ...


18
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, October 10, 2006: US07119445 (1 worldwide citation)

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


19
Satoru Katsurayama, Tomoe Yamashiro, Takashi Hirano: Semiconductor electronic component and semiconductor device using the same. Sumitomo Bakelite, Ditthavong Mori & Steiner P C, January 14, 2014: US08629564 (1 worldwide citation)

The problem of the present invention is to provide a chip-on-chip type semiconductor electronic component and a semiconductor device which can meet the requirements for further density increase of semiconductor integrated circuits. The present invention provides: a chip-on-chip type semiconductor el ...


20
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, June 26, 2003: US20030116859-A1 (1 worldwide citation)

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...



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