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Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, March 31, 2009: US07511362 (4 worldwide citation)

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is a step of forming electrodes (12) on a wafer (10); a step of providing ...


12
Himeno Yuji: Packaging of electronic component and semiconductor device. Sony, June 23, 2000: JP2000-174442 (3 worldwide citation)

PROBLEM TO BE SOLVED: To provide a reliable and economic method of packaging an electronic component even if a semicondutor element is buried in an insulated layer of a multilayer electronic circuit board by allowing part of the insulation layer to serve for a sealing section of the semiconductor el ...


13
Katsurayama Satoru, Yamashiro Tomoe, Hirano Takashi: Semiconductor electronic component and semiconductor device using the same. Sumitomo Bakelite, Katsurayama Satoru, Yamashiro Tomoe, Hirano Takashi, KOBAYASHI Hiroshi, May 8, 2008: WO/2008/054011 (3 worldwide citation)

A chip-on-chip type semiconductor electronic component which meets requirement of further density increase of semiconductor integrated circuits is provided. A semiconductor device is also provided. In the chip-on-chip type semiconductor electronic component, the circuit surface of a first semiconduc ...


14
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, October 6, 2009: US07598619 (2 worldwide citation)

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


15
Nakamura Toshinobu, Chinda Satoshi: Lead material for electronic component and semiconductor device using the same. Hitachi Cable, September 21, 2001: JP2001-257303 (2 worldwide citation)

PROBLEM TO BE SOLVED: To provide a lead material for electronic components which will not cause the problem of an environment contamination with lead.SOLUTION: The surface of the lead material 1 made of copper, its alloy, iron, its alloy, or the like is coated with a tin-copper alloy plating layer 2 ...


16
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, November 30, 2010: US07842598 (1 worldwide citation)

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providin ...


17
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, October 10, 2006: US07119445 (1 worldwide citation)

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


18
Satoru Katsurayama, Tomoe Yamashiro, Takashi Hirano: Semiconductor electronic component and semiconductor device using the same. Sumitomo Bakelite, Ditthavong Mori & Steiner P C, January 14, 2014: US08629564 (1 worldwide citation)

The problem of the present invention is to provide a chip-on-chip type semiconductor electronic component and a semiconductor device which can meet the requirements for further density increase of semiconductor integrated circuits. The present invention provides: a chip-on-chip type semiconductor el ...


19
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, June 26, 2003: US20030116859-A1 (1 worldwide citation)

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


20
Hashimoto Nobuaki: Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment. Seiko Epson, March 21, 2002: TW480636 (1 worldwide citation)

The present invention relates to an electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment, in which the package size is nearly the same as the size of a chip, and the component has a stress absorbing layer to eliminat ...



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