61
Bradley K Davis, Johannes O Voorman, Joao N V L Ramalho, Patrice Gamand: Circuit and method for testing a disk drive head assembly without probing. Hewlett Packard Company, Philips Electronics, Lane R Simmons, December 31, 1996: US05589777 (21 worldwide citation)

A preamplifier circuit for a computer data storage system disk drive read/write head (or HSA) includes multiple test modes to enable electrical testing of the preamplifier, the read/write heads, and associated circuitry without physically probing the components or circuitry. Communication between th ...


62
Oliverio Anthony Daniel, Ward Marvin Levi: Electrical testing instrument structure. Keithley Instruments, September 4, 1973: US3757218 (21 worldwide citation)

An electrical instrument for measuring or testing electrical characteristics, such as resistance or voltage, of test circuits is provided with a probe having an electrical contact tip for engaging a portion of such a test circuit. The contact tip is electrically connected to the instrument's measuri ...


63
Alexander J Yerman, James A Loughran: Tape automated manufacture of power semiconductor devices. General Electric Company, Bernard J Lacomis, James C Davis Jr, December 29, 1987: US04716124 (20 worldwide citation)

Power semiconductor devices are manufactured using a flexible metal tape carrier to facilitate automation of the manufacturing process. Control leads are fashioned from portions of the tape carrier, with a main portion of the tape carrier serving as a main current lead. The manufacturing process per ...


64
Stephen D Collier, Wayne E Hughes: Electrical testing device. Richard C Litman, April 25, 2000: US06054849 (20 worldwide citation)

An electrical testing device for determining the continuity between ground terminals of an electrical power cord and determining the electrical grounding of an electrical power tool. The electrical testing device can also be configured to determine the proper polarity on each of the hot, negative, a ...


65
Richard J Bergeron, Thomas J LaMothe, Joseph E Suarez, John A Thompson: Additive structure and method for testing semiconductor wire bond dies. International Business Machines Corporation, Heslin & Rothenberg, May 14, 1996: US05517127 (20 worldwide citation)

A structure and method for achieving burn-in and full functional testing of a semiconductor wire bond die are provided. The structure comprises an electrical conductor which connects a wire bond pad to a solderable test contact laterally displaced from the wire bond pad. The solderable test contact ...


66
January Kister: Probe cards employing probes having retaining portions for potting in a potting region. Astria Semiconductor Holdings, Deborah A Peacock, Samantha A Updegraff, Peacock Myers P C, August 31, 2010: US07786740 (19 worldwide citation)

Method and apparatus using a retention arrangement for probes used for electrical testing of a device under test (DUT). The apparatus has a number of probes each of which has a connect end for applying a test signal, a retaining portion, at least one arm portion and a contact tip for making an elect ...


67
January Kister: Space transformers employing wire bonds for interconnections with fine pitch contacts. MicroProbe, December 25, 2007: US07312617 (19 worldwide citation)

Method and apparatus for electrical testing of a device under test (DUT) that employs a connection board with signal contacts for applying test signals and a space transformer that has low pitch contacts arranged on one or more circumferential shelves that define an enclosure in the space transforme ...


68
Anthony R Weeks, Mark D Norris, Steven A Switzer: Wafer holder for semiconductor applications. Motorola, Bruce T Neel, December 30, 1997: US05703493 (19 worldwide citation)

A semiconductor substrate (15) is placed into a recessed area (12) of a support structure (10). A ring (20) is then placed on the support structure (10) to form a wafer holder (30) which provides support to the semiconductor substrate (15) during handling, transporting, or electrical testing operati ...


69
Lawrence T Clark, Mark A Beiley, Eric J Hoffman: Method and apparatus for electrical test of CMOS pixel sensor arrays. Intel Corporation, Blakely Sokoloff Taylor & Zafman, September 12, 2000: US06118482 (19 worldwide citation)

CMOS pixel sensors have been of interest as replacements for CCD's in imaging applications. Such devices promise lower power and simpler system level design through fewer power supply voltages and higher functional integration. It is difficult and cost ineffective to utilize images to test active pi ...


70
Long Robert Alvin, Lucas Joel William, Over William Roderick, Doty Donald Sudson: Harness manufacturing apparatus incorporating harness testing means. AMP Incorporated, Raring F W, Seitchik J L, Keating W J, May 27, 1975: US3885287 (19 worldwide citation)

Apparatus for inserting wires into the wire-receiving portions of contact terminals which are contained in a multi-contact electrical connector has a panel-like member upon which the connector is mounted and which serves to locate the connector in the apparatus during wire insertion. The panel-like ...