51
Benjamin V Fasano, Hai P Longworth, Vincent P Peterson III, Anthony L Plachy, Robert N Wiggin: Embedded structures to provide electrical testing for via to via and interface layer alignment as well as for conductive interface electrical integrity in multilayer devices. International Business Machines Corporation, Margaret A Pepper, Scully Scott Murphy & Presser, May 21, 2002: US06391669 (26 worldwide citation)

Multilayer substrates, are fabricated with the incorporation therein of non-destructive test structures utilized to provide visual and electrical test data to facilitate the ascertainment and assessment of potential electrical interface failures. Furthermore, there are provided embedded structures i ...


52
Alan D Cormier, Melvin S Weinberg: Means and methods for quantitative determination of analyte in liquids. AMDEV, Wolf Greenfield & Sacks, December 9, 1986: US04627893 (25 worldwide citation)

A testing module is provided having units which can be arranged seriatim to provide narrow through passageways linked to each other for quantitative determination of analytes passing through the units as by electrical testing with electrodes. Auxiliary passageways are preferably used in one unit to ...


53
James B Morris: Process for assembling integrated circuit packages. Control Data Corporation, Joseph A Genovese, Edward L Schwarz, April 12, 1988: US04736520 (25 worldwide citation)

Automatic manufacture of integrated circuit packages including a leadless chip carrier is facilitated by providing, in strip form, flexible tape circuitry having a dielectric layer and a conductive layer. Through selective etching, regularly spaced central openings are formed in the strip for subseq ...


54
Richard W Mace: Electrical testing apparatus. John W Ramseyer, Criddle & Western, July 29, 1980: US04215306 (25 worldwide citation)

Apparatus for analyzing operation of the electrical supply system of an automobile and for starting an automobile having a discharged battery comprises a battery mounted on a mobile cart. A jumper cable is attached to one of the terminals of the battery. A relay switch having a pair of normally open ...


55
Steve K Hsiung, Kevan V Tan: Systems and methods for package defect detection. LSI Logic Corporation, Conley Rose & Tayon, July 8, 2003: US06590409 (25 worldwide citation)

A charged particle imaging system may be used to perform package-level failure analysis by providing a Capacitive Coupling Voltage Contrast image of a portion of the semiconductor package. Preliminary failure analysis using Time Domain Reflectometry may determine whether a defect lies either outside ...


56
Richard J Bergeron, Thomas J LaMothe, Joseph E Suarez, John A Thompson: Additive structure and method for testing semiconductor wire bond dies. International Business Machines Corporation, Heslin & Rothenberg, May 14, 1996: US05517127 (24 worldwide citation)

A structure and method for achieving burn-in and full functional testing of a semiconductor wire bond die are provided. The structure comprises an electrical conductor which connects a wire bond pad to a solderable test contact laterally displaced from the wire bond pad. The solderable test contact ...


57
Pallab K Chatterjee, Al F Tasch Jr: Post-metal ion implant programmable MOS read only memory. Texas Instruments Incorporated, William E Hiller, Melvin Sharp, James T Comfort, May 26, 1981: US04268950 (24 worldwide citation)

An MOS read only memory, or ROM, is formed by a process compatible with standard silicon gate manufacturing methods. The ROM is programmed either after the top level of device interconnects has been patterned and sintered, usually the last step in the slice processing method before electrical testin ...


58
John L Pierce: Wafer testing interposer for a conventional package. Eaglestone Pareners I, Lawrence R Youst, Danamraj & Youst P C, March 4, 2003: US06529022 (24 worldwide citation)

The present invention provides a wafer interposer for electrical testing and assembly into a conventional package. The present invention provides an interposer comprising a support having an upper and a lower surface. One or more solder bumps are on the lower surface. One or more first electrical te ...


59
Charles Sve, Pierre Rogelio Valenzuela, Timothy Steven Wall, Robert Walter Francis, Robert Bay Pan, Steven John VanWormer: Compartmental fast thermal cycler. The Aerospace Corporation, Derrick Michael Reid, August 7, 2001: US06271024 (23 worldwide citation)

A fast thermal cycler has a temperature chamber divided into a top, hot compartment heated by heating lamps and a bottom cold compartment cooled by liquid nitrogen, for optimizing thermal cycling rates for devices under test, such as solar cells, for rapid thermal life testing where both compartment ...


60
George R Steber, David L Wiesemann, Thomas M Luebke: Auto-selecting, auto-ranging contact/noncontact voltage and continuity tester. Actuant Corporation, Quarles & Brady, November 2, 2004: US06812685 (23 worldwide citation)

An electrical testing device has non-contact AC voltage sensing, single probe contact AC voltage testing and voltage metering functions. Non-contact voltage sensing is used to detect the vicinity of a live AC conductor and single probe contact sensing is used to determine which conductor of a number ...