51
Alan D Cormier, Melvin S Weinberg: Means and methods for quantitative determination of analyte in liquids. AMDEV, Wolf Greenfield & Sacks, December 9, 1986: US04627893 (25 worldwide citation)

A testing module is provided having units which can be arranged seriatim to provide narrow through passageways linked to each other for quantitative determination of analytes passing through the units as by electrical testing with electrodes. Auxiliary passageways are preferably used in one unit to ...


52
James B Morris: Process for assembling integrated circuit packages. Control Data Corporation, Joseph A Genovese, Edward L Schwarz, April 12, 1988: US04736520 (25 worldwide citation)

Automatic manufacture of integrated circuit packages including a leadless chip carrier is facilitated by providing, in strip form, flexible tape circuitry having a dielectric layer and a conductive layer. Through selective etching, regularly spaced central openings are formed in the strip for subseq ...


53
Pallab K Chatterjee, Al F Tasch Jr: Post-metal ion implant programmable MOS read only memory. Texas Instruments Incorporated, William E Hiller, Melvin Sharp, James T Comfort, May 26, 1981: US04268950 (24 worldwide citation)

An MOS read only memory, or ROM, is formed by a process compatible with standard silicon gate manufacturing methods. The ROM is programmed either after the top level of device interconnects has been patterned and sintered, usually the last step in the slice processing method before electrical testin ...


54
Richard W Mace: Electrical testing apparatus. John W Ramseyer, Criddle & Western, July 29, 1980: US04215306 (23 worldwide citation)

Apparatus for analyzing operation of the electrical supply system of an automobile and for starting an automobile having a discharged battery comprises a battery mounted on a mobile cart. A jumper cable is attached to one of the terminals of the battery. A relay switch having a pair of normally open ...


55
Charles Sve, Pierre Rogelio Valenzuela, Timothy Steven Wall, Robert Walter Francis, Robert Bay Pan, Steven John VanWormer: Compartmental fast thermal cycler. The Aerospace Corporation, Derrick Michael Reid, August 7, 2001: US06271024 (23 worldwide citation)

A fast thermal cycler has a temperature chamber divided into a top, hot compartment heated by heating lamps and a bottom cold compartment cooled by liquid nitrogen, for optimizing thermal cycling rates for devices under test, such as solar cells, for rapid thermal life testing where both compartment ...


56
John L Pierce: Wafer testing interposer for a conventional package. Eaglestone Pareners I, Lawrence R Youst, Danamraj & Youst P C, March 4, 2003: US06529022 (23 worldwide citation)

The present invention provides a wafer interposer for electrical testing and assembly into a conventional package. The present invention provides an interposer comprising a support having an upper and a lower surface. One or more solder bumps are on the lower surface. One or more first electrical te ...


57
Steve K Hsiung, Kevan V Tan: Systems and methods for package defect detection. LSI Logic Corporation, Conley Rose & Tayon, July 8, 2003: US06590409 (23 worldwide citation)

A charged particle imaging system may be used to perform package-level failure analysis by providing a Capacitive Coupling Voltage Contrast image of a portion of the semiconductor package. Preliminary failure analysis using Time Domain Reflectometry may determine whether a defect lies either outside ...


58
January Kister: Probe skates for electrical testing of convex pad topologies. MicroProbe, Lumen Patent Firm, October 14, 2008: US07436192 (22 worldwide citation)

A probe for engaging a conductive pad is provided. The probe includes a probe contact end for receiving a test current, a probe retention portion below the contact end, a block for holding the probe retention portion, a probe arm below the retention portion, a probe contact tip below the arm, and a ...


59
Douglas R Hall: Component feeder system. Reel Tech, February 26, 1991: US04995157 (21 worldwide citation)

A chip component handling and loading system for orienting and transporting a plurality of generally rectangular chip components includes a storage and feed location which, by means of vibratory action, randomly shakes out the chip components into or onto a series of twenty-five substantially parall ...


60
Alexander J Yerman, James A Loughran: Tape automated manufacture of power semiconductor devices. General Electric Company, Bernard J Lacomis, James C Davis Jr, December 29, 1987: US04716124 (20 worldwide citation)

Power semiconductor devices are manufactured using a flexible metal tape carrier to facilitate automation of the manufacturing process. Control leads are fashioned from portions of the tape carrier, with a main portion of the tape carrier serving as a main current lead. The manufacturing process per ...



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