41
Floyd F Schemmel: Adjustable probe for probe assembly. Texas Instruments Incorporated, B Peter Barndt, James T Comfort, Melvin Sharp, November 27, 1990: US04973903 (31 worldwide citation)

An adjustable probe to be utilized in probe card technology during the multiprobe electrical testing of integrated circuits. The adjustable probe includes a pair of slots for expansion/contraction and adjustment to obtain a high degree of planarization and placement accuracy of the probe needle.


42
Martin J Edwards: Electronic drive circuits for active matrix devices, and a method of self-testing and programming such circuits. U S Philips Corporation, Steven R Biren, November 7, 1995: US05465053 (31 worldwide citation)

A shift register or other electronic drive circuit, for an LCD or other active matrix device includes a series of circuit blocks each having redundancy in the form of parallel circuit paths. When the circuit is turned on, self-testing and redundancy selection is carried out by individual test and co ...


43
Rodolphe Simon, Peter Seamans: Combination hand tool and electrical testing device. Anthony D Pellegrini, February 1, 2005: US06848139 (30 worldwide citation)

The invention is directed to a device combining a handled tool, such as wire strippers, with one or more testing components useful for testing electrical circuits, such as continuity testers and voltage detectors, with the testing components integrated into a like number of handle grips.


44
Charles A Tucci: Mechanically self-sealing closure. Cordis Corporation, Kenway & Jenney, October 30, 1984: US04479489 (29 worldwide citation)

Disclosed is a plug or closure for sealing the electrical terminal block of a cardiac pacing device from contact with body fluids while allowing access to the terminal block when the closure is in place. The closure is made of an elastomeric material and includes an upper surface containing a first ...


45
Yoshio Saito, James C Lau, Steven S Chan, Richard P Malmgren: On-wafer integrated circuit electrical testing. TRW, August 9, 1994: US05336992 (28 worldwide citation)

An electrical testing device is provided for testing integrated circuits located on a wafer. The testing device employs a multi-layer test circuit having a plurality of contacts for contacting the integrated circuits on a wafer. The layers of the test circuit are embedded in a flexible, supportive d ...


46
Richard W Jarvis, Iraj Emami, John L Nistler, Michael G McIntyre: Multipurpose defect test structure with switchable voltage contrast capability and method of use. Advanced Micro Devices, Kevin L Daffer, Conley Rose & Tayon P C, October 2, 2001: US06297644 (28 worldwide citation)

A test structure which includes alternating grounded and floating conductive lines may be used to test the formation of conductive features on an integrated circuit topography. During irradiation of the conductive lines from an electron source, the grounded conductive lines will appear darker than t ...


47
Stephen D Collier, Wayne E Hughes: Electrical testing device. Richard C Litman, November 27, 2001: US06323652 (26 worldwide citation)

An electrical testing device for determining the continuity between ground terminals of an electrical power cord and determining the electrical grounding of an electrical power tool. The electrical testing device can also be configured to determine the proper polarity on each of the hot, negative, a ...


48
Anthony J Smith, Timothy J Sheppard: Electrical testing apparatus and methods. Racal Automation, Leydig Voit Osann Mayer & Holt, December 21, 1982: US04365334 (26 worldwide citation)

A system is disclosed for generating test data for testing logic circuits. It has a store storing a respective Logic List for each of the basic logic circuit types in the form of a list of logic states identifying terminals of the logic circuit to which specified data inputs are to be applied and te ...


49
Benjamin V Fasano, Hai P Longworth, Vincent P Peterson III, Anthony L Plachy, Robert N Wiggin: Embedded structures to provide electrical testing for via to via and interface layer alignment as well as for conductive interface electrical integrity in multilayer devices. International Business Machines Corporation, Margaret A Pepper, Scully Scott Murphy & Presser, May 21, 2002: US06391669 (26 worldwide citation)

Multilayer substrates, are fabricated with the incorporation therein of non-destructive test structures utilized to provide visual and electrical test data to facilitate the ascertainment and assessment of potential electrical interface failures. Furthermore, there are provided embedded structures i ...


50
Robert C Lutz, Lloyd B Dickson, Ralph James Eddington: Semiconductor wafer electrical testing with a mobile chiller plate for rapid and precise test temperature control. Lucas Signatone Corporation, Law Offices of Thomas E Schatzel, August 3, 2004: US06771086 (26 worldwide citation)

A semiconductor-wafer chuck for heating and cooling a device-under-test includes a heat-spreader plate with a clamping surface for a semiconductor wafer. A heater is disposed within the heat-spreader plate. A chiller heat-exchanger provides for heat removal. A motion control system is used to move t ...



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