Stephen Mark Sekel: Self-calibrating electrical test probe. Le Croy Corporation, Law Office of Karen Dana Oster, March 22, 2005: US06870359 (40 worldwide citation)

A self-calibrating test probe system of the present invention does not require probing head removal and replacement. Using the system of the present invention, the test probe and/or the entire system (including a testing instrument) may be calibrated or may self-calibrate while the probing head rema ...

Alexander J Yerman, Constantine A Neugebauer: Hermetic power chip packages. General Electric Company, Paul R Webb II, James C Davis Jr, February 24, 1987: US04646129 (40 worldwide citation)

Hermetic power chip packages are constructed in building block form to reduce the cost of electrical testing of power chips. The power chip packages utilized dielectric plates with metallic sheets bonded to the dielectric plates. Electric access to at least selected terminals of a power chip is gain ...

Alan G Wood, Tim J Corbett, Warren M Farnworth: Universal wafer carrier for wafer level die burn-in. Micron Technology, Trask Britt & Rossa, July 11, 2000: US06087845 (39 worldwide citation)

A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical test equipment. ...

William Petlock Jr: Bellows-type electrical test contact. G Donald Weber Jr, December 29, 1981: US04307928 (39 worldwide citation)

The invention is a unique test contact and connector useful in automatic testing equipment (ATE). The contact connector has a bellows-type configuration which has no internal moving or sliding parts. Compliance is effected through compression of the bellows. With a helical bellows design, the contac ...

Alan G Wood, Trung T Doan, Warren M Farnworth, Tim J Corbett: Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor. Micron Technology, Stephen A Gratton, December 17, 1996: US05585282 (37 worldwide citation)

A process for forming die contacting substrate for establishing ohmic contact with the die is formed with raised portions on contact members. The raised portions are dimensioned so that a compression force applied to the die against the substrate results in a limited penetration of the contact membe ...

Paul G Carey, Jesse B Thompson, Nicolas J Colella, Kenneth A Williams: Solar cell array interconnects. Regents of the University of California, Henry P Sartorio, L E Carnahan, November 14, 1995: US05466302 (36 worldwide citation)

Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this inv ...

Salman Akram: LOC SIMM. Micron Technology, Trask Britt & Rossa, March 3, 1998: US05723907 (35 worldwide citation)

A lead-over-chip single-in-line memory module (LOC SIMM) and method of manufacturing is disclosed that provides for shortened wire bonds and ease of rework for unacceptable semiconductor dice. More specifically, the LOC SIMM of the present invention includes a plurality of slots extending through a ...

Jeffery L DeDino: Display card for a battery package. The Shelby Paper Box Company, Tarolli Sundheim & Covell, September 4, 1990: US04953700 (35 worldwide citation)

A battery package includes a display card and a plastic casing rotatably mounted on the display card. The display card and the plastic casing define therebetween a plurality of compartments uniformly arranged in a circular path. Each of the compartments is provided for storing a battery. The display ...

Keith E Barrett: Test interposer for use with ball grid array packages, assemblies and ball grid array packages including same, and methods. Micron Technology, TraskBritt, September 17, 2002: US06452807 (34 worldwide citation)

An interposer for evaluating an electrical characteristic of a ball grid array package or of a semiconductor die thereof. The interposer includes electrically conductive vias positioned correspondingly to bond pads of the semiconductor die and to the electrical contacts or terminals of a carrier sub ...

Rodolphe Simon, Peter Seamans: Combination hand tool and electrical testing device. Anthony D Pellegrini, February 1, 2005: US06848139 (33 worldwide citation)

The invention is directed to a device combining a handled tool, such as wire strippers, with one or more testing components useful for testing electrical circuits, such as continuity testers and voltage detectors, with the testing components integrated into a like number of handle grips.

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