21
William M Beckenbaugh, William H Lytle, Bernard Berman: Method of forming contact pads for wafer level testing and burn-in of semiconductor dice. Motorola, Rennie William Dover, Harry A Wolin, January 14, 1997: US05593903 (50 worldwide citation)

A method of forming contact pads (140) that allows for wafer level testing and burn-in of semiconductor die (22). A plurality of semiconductor die (22) are formed upon a semiconductor wafer (20), each semiconductor die (22) having a plurality of bonding pads (78). A contact pad (140) is formed overl ...


22
Martin G Buehler: Split-cross-bridge resistor for testing for proper fabrication of integrated circuits. The United States of America represented by the Administration of the United States National Aeronautics and Space Administration, Paul F McCaul, John R Manning, Thomas H Jones, May 7, 1985: US04516071 (45 worldwide citation)

An electrical testing structure and method whereby a test structure is fabricated on, e.g., a large scale integrated circuit wafer along with the circuit components and has a van der Pauw cross resistor in conjunction with a bridge resistor and a split bridge resistor, the latter having two channels ...


23
Samuel S S Lim, Siew K Tan: Reusable carrier for burn-in/testing on non packaged die. Sunright, Morgan & Finnegan L, August 6, 1996: US05543725 (43 worldwide citation)

A re-usable carrier having a cavity for receiving unpackaged die with molded metallized probe heads to establish contact with the bond pads of the die, enabling the die to be functionally tested through the existing test systems. The novel carrier has metallized contacts for making electrical connec ...


24
Samuel S S Lim, Siew K Tan: Reusable carrier for burn-in/testing of non packaged die. Sunright, Morgan & Finnegan, June 25, 1996: US05530376 (43 worldwide citation)

A re-usable carrier having a cavity for receiving a packaged die with molded metallized probe heads to establish contact with the bond pads of the die, enabling the die to be functionally tested through the existing test systems. The novel carrier has metallized contacts for making electrical connec ...


25
David Pih: High density test connector for disk drives in a high volume manufacturing environment. International Business Machines Corporation, Noreen A Krall, Robert B Martin, January 23, 2001: US06177805 (43 worldwide citation)

A test connector for making electrical tests on a disk drive on a high volume manufacturing line. The test connector comprises a high density connector header for electrical connection to a disk drive electrical connector fixed to a printed circuit board (PCB) card having well-separated, large area ...


26
Jonathon H Katz: Test pin. Teradyne, August 8, 1978: US04105970 (42 worldwide citation)

An electrical testing pin characterized by a crown with an inner contact area and a plurality of outer contact areas, the former extending longitudinally beyond the latter.


27
James E Byrum: IC carrier system. Albert L Gabriel, July 21, 1987: US04681656 (41 worldwide citation)

A method of laser-machining IC carrier bodies from a sheet ceramic blank, and the IC carrier products produced from such laser-machining. The ceramic blank, preferably of alumina or beryllia, is high temperature fired to permanently fix its size and shape prior to the laser-machining, permitting a m ...


28
Samuel S S Lim, Siew K Tan: Reusable carrier for burn-in/testing on non packaged die. Sunright, Morgan & Finnegan L, November 5, 1996: US05572140 (40 worldwide citation)

A re-usable carrier having a cavity for receiving unpackaged die with molded metallized probe heads to establish contact with the bond pads of the die, enabling the die to be functionally tested through the existing test systems. The novel carrier has metallized contacts for making electrical connec ...


29
Stephen Mark Sekel: Self-calibrating electrical test probe. Le Croy Corporation, Law Office of Karen Dana Oster, March 22, 2005: US06870359 (40 worldwide citation)

A self-calibrating test probe system of the present invention does not require probing head removal and replacement. Using the system of the present invention, the test probe and/or the entire system (including a testing instrument) may be calibrated or may self-calibrate while the probing head rema ...


30
Alan G Wood, Tim J Corbett, Warren M Farnworth: Universal wafer carrier for wafer level die burn-in. Micron Technology, Trask Britt & Rossa, July 11, 2000: US06087845 (39 worldwide citation)

A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical test equipment. ...



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