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RATHBURN James: SUPPORT DINTERCONNEXION ÉLECTRIQUE DE DISPOSITIF À CIRCUIT INTÉGRÉ, ELECTRICAL INTERCONNECT IC DEVICE SOCKET. HSIO TECHNOLOGIES, RATHBURN James, SCHWAPPACH Karl G, June 14, 2012: WO/2012/078493 (44 worldwide citation)

A surface mount electrical interconnect is disclosed that provides an interface between a PCB and solder balls of a BGA device. The electrical interconnect includes a socket substrate and a plurality of electrically conductive contact members. The socket substrate has a first layer with a plurality ...


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RATHBURN James: SUPPORT DE DISPOSITIF DE CIRCUIT IMPRIMÉ À INTERCONNEXION ÉLECTRIQUE, ELECTRICAL INTERCONNECT IC DEVICE SOCKET. HSIO TECHNOLOGIES, RATHBURN James, SCHWAPPACH Karl G, June 7, 2012: WO/2012/074969 (44 worldwide citation)

A surface mount electrical interconnect adapted to provide an interface between contact pads on an LGA device and a PCB. The electrical interconnect includes a socket substrate having a first surface with a plurality of first openings having first cross-sections, a second surface with a plurality of ...


3
James Rathburn: Electrical interconnect IC device socket. HSIO Technologies, April 19, 2016: US09320133 (2 worldwide citation)

A surface mount electrical interconnect is disclosed that provides an interface between a PCB and solder balls of a BGA device. The electrical interconnect includes a socket substrate and a plurality of electrically conductive contact members. The socket substrate has a first layer with a plurality ...


4
James Rathburn: Electrical interconnect IC device socket. HSIO Technologies, March 1, 2016: US09276339 (2 worldwide citation)

A surface mount electrical interconnect adapted to provide an interface between contact pads on an LGA device and a PCB. The electrical interconnect includes a socket substrate having a first surface with a plurality of first openings having first cross-sections, a second surface with a plurality of ...


5
ELECTRICAL INTERCONNECT IC DEVICE SOCKET. HSIO TECHNOLOGIES, August 15, 2013: US20130206468-A1

A surface mount electrical interconnect is disclosed that provides an interface between a PCB and solder balls of a BGA device. The electrical interconnect includes a socket substrate and a plurality of electrically conductive contact members. The socket substrate has a first layer with a plurality ...


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ELECTRICAL INTERCONNECT IC DEVICE SOCKET. HSIO TECHNOLOGIES, August 15, 2013: US20130210276-A1

A surface mount electrical interconnect adapted to provide an interface between contact pads on an LGA device and a PCB. The electrical interconnect includes a socket substrate having a first surface with a plurality of first openings having first cross-sections, a second surface with a plurality of ...