1
Fred Thomas Fred Thomas
Bruno Richet, Fred Charles Thomas, Arthur Sandoval, Daniel Francis Kennedy: Hard-disk Drive Insertion. July 21, 2011: US20110173805-A1

A hard-disk drive insertion mechanism includes carrier mechanism that moves longitudinally with the hard-disk drive as it is being inserted toward said electrical connector. The carrier mechanism includes engagement features for engaging the hard-disk drive as it is being inserted. The insertion mec ...


2
David Sherrer
David W Sherrer, Jean Marc Rollin: Coaxial transmission line microstructures and methods of formation thereof. Nuvotronics, Sherr & Vaughn PLLC, March 1, 2011: US07898356 (48 worldwide citation)

Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have p ...


3
David Sherrer
David W Sherrer, Jean Marc Rollin: Coaxial transmission line microstructure including an enlarged coaxial structure for transitioning to an electrical connector. Nuvotronics, Niels Haun, Dann Dorfman Herrell & Skillman P C, September 24, 2013: US08542079 (22 worldwide citation)

Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have p ...


4
Belgacem Haba Belgacem (Bel) Haba
Ravindranath T Kollipara, David Nguyen, Belgacem Haba: Clock routing in multiple channel modules and bus systems and method for routing the same. Rambus, Morgan Lewis & Bockius, November 1, 2011: US08050042 (1 worldwide citation)

The terminating module and method include integrated circuits and a termination circuit which receive clock signals from the integrated circuit. The integrated circuit includes at least one memory integrated circuit mounted on a printed circuit board. An electrical connector is configured to couple ...


5
Belgacem Haba Belgacem (Bel) Haba
Para Kanagasabai Segaram, Joseph Fjelstad, Belgacem Haba: Method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead, and a semiconductor device made thereby. Silicon Pipe, Shemwell Gregory & Courtney, August 23, 2005: US06933610 (1 worldwide citation)

In a semiconductor device having a semiconductor die without an ESD circuit and a separate ESD circuit and an external lead, the external lead is first bonded to the separate ESD circuit. Thereafter, the separate ESD circuit is bonded to the semiconductor die. As a result, in the process of bonding ...


6
David Sherrer
David W Sherrer, Jean Marc Rollin: Coaxial transmission line microstructures and methods of formation thereof. November 10, 2011: US20110273241-A1

Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have p ...


7
Belgacem Haba Belgacem (Bel) Haba
Ravindranath T Kollipara, David Nguyen, Belgacem Haba: Clock Routing in Mulitiple Channel Modules and Bus Systems. January 5, 2012: US20120001670-A1

The terminating module includes integrated circuits and a termination circuit which receive clock signals from the integrated circuit. The integrated circuit includes at least one memory integrated circuit mounted on a printed circuit board. An electrical connector is configured to couple the termin ...


8
Belgacem Haba Belgacem (Bel) Haba
Para Kanagasabai Segaram, Joseph Fjelstad, Belgacem Haba: Method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead, and a semiconductor device made thereby. Gray Cary Ware & Freidenrich, November 6, 2003: US20030205802-A1

In a semiconductor device having a semiconductor die without an ESD circuit and a separate ESD circuit and an external lead, the external lead is first bonded to the separate ESD circuit. Thereafter, the separate ESD circuit is bonded to the semiconductor die. As a result, in the process of bonding ...


9
Belgacem Haba Belgacem (Bel) Haba
Ravindranath T Kollipara, David Nguyen, Belgacem Haba: Clock routing in multiple channel modules and bus systems. Rambus, Morgan Lewis & Bockius Rambus, November 17, 2005: US20050254221-A1

The terminating module includes integrated circuits and a termination circuit which receive clock signals from the integrated circuit. The integrated circuit includes at least one memory integrated circuit mounted on a printed circuit board. An electrical connector is configured to couple the termin ...


10
David Sherrer
David W Sherrer, Jean Marc Rollin: Coaxial transmission line microstructures and methods of formation thereof. Rohm and Haas Electronic Materials, Jonathan D Baskin, Rohm and Haas Electronic Materials, October 9, 2008: US20080246562-A1

Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have p ...



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