1
Alan G Wood, Warren M Farnworth, Ford Grigg, Salman Akram: Direct die contact (DDC) semiconductor package. Micron Technology, Stephen A Gratton, November 21, 2000: US06150717 (156 worldwide citation)

A semiconductor package and method for fabricating the package are provided. The package includes a housing having individual channels, each adapted to retain a semiconductor die in electrical communication with electrical connectors. The dice can include solder bumps, formed on electrodes, using el ...


2
Alan G Wood, Warren M Farnworth, Ford Grigg, Salman Akram: Direct die contact (DDC) semiconductor package. Micron Technology, Stephen A Gratton, August 22, 2000: US06107122 (142 worldwide citation)

A semiconductor package and method for fabricating the package are provided. The package includes a housing having individual channels, each adapted to retain a semiconductor die in electrical communication with electrical connectors. The dice can include solder bumps, formed on electrodes, using el ...