1
David Sherrer
David W Sherrer, James R Reid Jr: Devices and methods for solder flow control in three-dimensional microstructures. Nuvotronics, Niels Haun, Dann Dorfman Herrell & Skillman PC, October 21, 2014: US08866300 (4 worldwide citation)

Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.


2
David W Sherrer, James R Reid: Devices and methods for solder flow control in three-dimensional microstructures. NUVOTRONICS, Niels Haun, Dann Dorfman Herrell and Skillman P C, November 29, 2016: US09505613

Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.


3
David W Sherrer, James R Reid: Devices and methods for solder flow control in three-dimensional microstructures. NUVOTRONICS, Niels Haun, Dann Dorfman Herrell and Skillman P C, September 11, 2018: US10076042

Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.


4
Devices and Methods for Solder Flow Control in Three-Dimensional Microstructures. January 8, 2015: US20150007939-A1

Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.


5
Devices and Methods for Solder Flow Control in Three-Dimensional Microstructures. February 23, 2017: US20170055348-A1

Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.