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John Sudijono, Liang Ch O Hsia, Liu Wu Ping: Copper recess formation using chemical process for fabricating barrier cap for lines and vias. Chartered Semiconductor Manufacturing, George O Saile, Rosemary L S Pike, Stephen G Stanton, March 16, 2004: US06706625 (93 worldwide citation)

A method of fabricating a planarized barrier cap layer over a metal structure comprising the following steps. A substrate having an opening formed therein is provided. The substrate having an upper surface. A planarized metal structure is formed within the opening. The planarized metal structure bei ...


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