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RATHBURN James: STRUCTURE DE CIRCUIT ÉLECTRIQUE À TROUS DINTERCONNEXION BLINDÉS À PILIERS DE CUIVRE, COPPER PILLAR FULL METAL VIA ELECTRICAL CIRCUIT STRUCTURE. HSIO TECHNOLOGIES, RATHBURN James, SCHWAPPACH Karl G, September 20, 2012: WO/2012/125331 (44 worldwide citation)

An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the first surface of the first circuitry layer to include a plurality of first recesses. A conductive material is deposited in a plurality of the fi ...


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James Rathburn: Copper pillar full metal via electrical circuit structure. HSIO Technologies, Stoel Rives, March 24, 2015: US08987886 (29 worldwide citation)

An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the first surface of the first circuitry layer to include a plurality of first recesses. A conductive material is deposited in a plurality of the fi ...


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James Rathburn: Hybrid printed circuit assembly with low density main core and embedded high density circuit regions. HSIO Technologies, July 4, 2017: US09699906 (1 worldwide citation)

A high density region for a low density circuit. At least a first liquid dielectric layer is deposited on the first surface of a first circuitry layer. The dielectric layer is imaged to create plurality of first recesses. Surfaces of the first recesses are plated electro-lessly with a conductive mat ...


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Jim Rathburn: Copper pillar full metal via electrical circuit structure. HSIO Technologies, March 27, 2018: US09930775

An electrical interconnect including a first circuitry layer with a first surface and a second surface. A first liquid dielectric layer is imaged directly on the first surface of the first circuitry layer to form a first dielectric layer with a plurality of first recesses. Conductive plating substan ...


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James Rathburn: Copper pillar full metal via electrical circuit structure. Hsio Technologies, July 5, 2012: US20120168948-A1

An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the first surface of the first circuitry layer to include a plurality of first recesses. A conductive material is deposited in a plurality of the fi ...


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COPPER PILLAR FULL METAL VIA ELECTRICAL CIRCUIT STRUCTURE. HSIO TECHNOLOGIES, August 14, 2014: US20140225255-A1

An electrical interconnect including a first circuitry layer with a first surface and a second surface. A first liquid dielectric layer is imaged directly on the first surface of the first circuitry layer to form a first dielectric layer with a plurality of first recesses. Conductive plating substan ...


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HYBRID PRINTED CIRCUIT ASSEMBLY WITH LOW DENSITY MAIN CORE AND EMBEDDED HIGH DENSITY CIRCUIT REGIONS. October 19, 2017: US20170303401-A1

A high density region for a low density circuit. At least a first liquid dielectric layer is deposited on the first surface of a first circuitry layer. The dielectric layer is imaged to create plurality of first recesses. Surfaces of the first recesses are plated electro-lessly with a conductive mat ...


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HIGH DENSITY, HIGH PERFORMANCE ELECTRICAL INTERCONNECT CIRCUIT STRUCTURE. May 3, 2018: US20180124928-A1

A method of making a fusion bonded circuit structure. Each major surface of an LCP substrate is provided with a seed layers of a conductive material. Resist layers are deposited on the seed layers. The resist layers are processed to create recesses corresponding to a desired circuitry layers on each ...