1
Richard K Klein, Darrell M Erb, Steven Avanzino, Robin Cheung, Scott Luning, Bryan Tracy, Subhash Gupta, Ming Ren Lin: Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device. Advanced Micro Devices, Foley & Lardner, June 17, 1997: US05639691 (8 worldwide citation)

A multilayer semiconductor structure includes a conductive via. The conductive via includes a pellet of metal having a high resistance to electromigration. The pellet is made from a conformal layer of copper or gold deposited over the via to form a copper or gold reservoir or contact located in the ...


2
Richard K Klein, Darrell Erb, Steven Avanzino, Robin Cheung, Scott Luning, Bryan Tracy, Subhash Gupta, Ming Ren Lin: Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device. Advanced Micro Devices, Foley & Lardner, July 8, 1997: US05646448 (5 worldwide citation)

A multilayer semiconductor structure includes a conductive via. The conductive via includes a pellet of metal having a high resistance to electromigration. The pellet is made from a conformal layer of copper or gold deposited over the via to form a copper or gold reservoir or contact located in the ...