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Igor Y Khandros, Benjamin N Eldridge, Gaetan L Mathieu, Thomas H Dozier, William D Smith: Contact carriers (tiles) for populating larger substrates with spring contacts. FormFactor, Gerald E Linden, Fenwick & West, September 15, 1998: US05806181 (235 worldwide citation)

The invention relates to making temporary, pressure connections between electronic components and, more particularly, to techniques for performing test and burn-in procedures on semiconductor devices prior to their packaging, preferably prior to the individual semiconductor devices being singulated ...


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Igor Y Khandros, Benjamin N Eldridge, Gaetan L Mathieu, Thomas H Dozier, William D Smith: Contact carriers (tiles) for populating larger substrates with spring contacts. FormFactor, N Kenneth Burraston, Stuart L Merkadeau, May 25, 2004: US06741085 (107 worldwide citation)

A plurality of contact elements, such as contact bumps or free-standing spring contacts including both monolithic and composite interconnection elements, are mounted to relatively small tile substrates which, in turn, are mounted and connected to a relatively large electronic component substrate, th ...


3
Igor Y Khandros, Benjamin N Eldridge, Gaetan L Mathieu, Thomas H Dozier II, William D Smith: Contact carriers (tiles) for populating larger substrates with spring contacts. FormFactor, N Kenneth Burraston, November 28, 2006: US07140883 (26 worldwide citation)

An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the ...


4
Benjamin N Eldridge, Thomas H Dozier II, Igor Y Khandros, Gaetan L Mathieu, William D Smith: Contact carriers (tiles) for populating larger substrates with spring contacts. FormFactor, N Kenneth Burraston, March 25, 2008: US07347702 (12 worldwide citation)

An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the ...


5
Benjamin N Eldridge, Thomas H Dozier II, Igor Y Khandros, Gaetan L Mathieu, William D Smith: Contact carriers (tiles) for populating larger substrates with spring contacts. FormFactor, N Kenneth Burraston, May 11, 2010: US07714598 (5 worldwide citation)

An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the ...


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Igor Y Khandros, Benjamin N Eldridge, Gaetan L Mathieu, Thomas H Dozier, William D Smith: Contact carriers (tiles) for populating larger substrates with spring contacts. FormFactor, Formfactor, Legal Department, August 26, 2004: US20040163252-A1

An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the ...


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Igor Y Khandros, Benjamin N Eldridge, Gaetan L Mathieu, Thomas H Dozier, William D Smith: Contact Carriers (Tiles) For Populating Larger Substrates With Spring Contacts. FormFactor, N Kenneth Burraston, Kirton & Mcconkie, April 5, 2007: US20070075715-A1

An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the ...


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Igor Y Khandros, Benjamin N Eldridge, Gaetan L Mathieu, Thomas H Dozier, William D Smith: Contact carriers (tiles) for populating larger substrates with spring contacts. FormFactor, N Kenneth Burraston, Kirton & Mcconkie, September 25, 2008: US20080231305-A1

An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the ...


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