1
Lan H Hoang, Paul Ying Fung Wu: Composite flip-chip package with encased components and method of fabricating same. Xilinx, Robert Brush, May 27, 2008: US07378733 (29 worldwide citation)

Composite flip-chip with encased components and method of fabricating the same is described. One aspect of the invention relates to fabricating composite flip-chip packages for integrated circuit dice. Interposing substrates are formed. At least one discrete component is attached to a bottom surface ...


2
Lan H Hoang, Paul Ying Fung Wu: Composite flip-chip package with encased components and method of fabricating same. Xilinx, Robert M Brush, Lois D Cartier, April 13, 2010: US07696006 (16 worldwide citation)

Composite flip-chip with encased components and method of fabricating the same is described. One aspect of the invention relates to fabricating composite flip-chip packages for integrated circuit dice. Interposing substrates are formed. At least one discrete component is attached to a bottom surface ...