1
Belgacem Haba Belgacem (Bel) Haba
Michael J Nystrom, Belgacem Haba, Giles Humpston: Compliant terminal mountings with vented spaces and methods. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 21, 2009: US07521276

A method of making chip assemblies includes providing an in-process assembly including a semiconductor wafer, a wafer compliant structure overlying a front surface of the wafer and cavities, and terminals carried on the compliant structure adjacent the cavities and electrically connected to the wafe ...


2
Belgacem Haba Belgacem (Bel) Haba
Michael J Nystrom, Belgacem Haba, Giles Humpston: Compliant terminal mountings with vented spaces and methods. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 18, 2008: US07453139

A compliant structure is provided on a semiconductor wafer. The compliant structure includes cavities. The compliant structure and the wafer seal the cavities during process steps used to form conductive elements on the compliant structure. After processing, vents are opened to connect the cavities ...


3
Belgacem Haba Belgacem (Bel) Haba
Michael J Nystrom, Belgacem Haba, Giles Humpston: Compliant terminal mountings with vented spaces and methods. Tessera, Tessera, LERNER DAVID et al, June 28, 2007: US20070148824-A1

A method of making chip assemblies includes providing an in-process assembly including a semiconductor wafer, a wafer compliant structure overlying a front surface of the wafer and cavities, and terminals carried on the compliant structure adjacent the cavities and electrically connected to the wafe ...


4
Belgacem Haba Belgacem (Bel) Haba
Michael J Nystrom, Belgacem Haba, Giles Humpston: Compliant terminal mountings with vented spaces and methods. Tessera, Tessera, LERNER DAVID et al, June 28, 2007: US20070145536-A1

A compliant structure is provided on a semiconductor wafer. The compliant structure includes cavities. The compliant structure and the wafer seal the cavities during process steps used to form conductive elements on the compliant structure. After processing, vents are opened to connect the cavities ...


5
Nystrom Michael J, Haba Belgacem, Humpston Giles: Compliant terminal mountings with vented spaces and methods. Tessera, jian wei, January 21, 2009: CN200680049493

A compliant structure 36 is provided on a semiconductor wafer 22. The compliant structure 36 includes cavities 42. The compliant structure 36 and the wafer 22 seal the cavities 42 during process steps used to form conductive elements on the compliant structure. After processing, vents 58 are opened ...


6
Nystrom Michael J, Haba Belgacem, Humpston Giles: Compliant terminal mountings with vented spaces and methods. Tessera, Nystrom Michael J, Haba Belgacem, Humpston Giles, DOHERTY Michael J, July 5, 2007: WO/2007/075789

A compliant structure 36 is provided on a semiconductor wafer 22. The compliant structure 36 includes cavities 42. The compliant structure 36 and the wafer 22 seal the cavities 42 during process steps used to form conductive elements on the compliant structure. After processing, vents 58 are opened ...


7
Nystrom Michael J, Haba Belgacem, Humpston Giles: Compliant terminal mountings with vented spaces and methods. Tessera, September 12, 2008: KR1020087018445

A compliant structure 36 is provided on a semiconductor wafer 22. The compliant structure 36 includes cavities 42. The compliant structure 36 and the wafer 22 seal the cavities 42 during process steps used to form conductive elements on the compliant structure. After processing, vents 58 are opened ...