1
Rathburn James: Compliant printed circuit area array semiconductor device package. HSIO TECHNOLOGIES, Schwappach Karl G, December 9, 2010: WO/2010/141311 (44 worldwide citation)

An integrated circuit (IC) package for an IC device, and a method of making the same. The IC package includes an interconnect assembly with at least one printed compliant layer, a plurality of first contact members located along a first major surface, a plurality of second contact members located al ...


2
James Rathburn: Compliant printed circuit area array semiconductor device package. HSIO TECHNOLOGIES, Stoel Rives, June 9, 2015: US09054097 (3 worldwide citation)

An integrated circuit (IC) package for an IC device, and a method of making the same. The IC package includes an interconnect assembly with at least one printed compliant layer, a plurality of first contact members located along a first major surface, a plurality of second contact members located al ...


3
James Rathburn: Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection. HSIO Technologies, April 4, 2017: US09613841 (1 worldwide citation)

An area array integrated circuit (IC) package for an IC device. The IC package includes a first substrate with conductive traces electrically coupled to the IC device. An interconnect assembly having a first surface is mechanically coupled to the first substrate. The interconnect assembly includes a ...


4
Jim Rathburn: Copper pillar full metal via electrical circuit structure. HSIO Technologies, March 27, 2018: US09930775

An electrical interconnect including a first circuitry layer with a first surface and a second surface. A first liquid dielectric layer is imaged directly on the first surface of the first circuitry layer to form a first dielectric layer with a plurality of first recesses. Conductive plating substan ...


5
James Rathburn: Compliant printed circuit area array semiconductor device package. Hsio Technologies, March 15, 2012: US20120061846-A1

An integrated circuit (IC) package for an IC device, and a method of making the same. The IC package includes an interconnect assembly with at least one printed compliant layer, a plurality of first contact members located along a first major surface, a plurality of second contact members located al ...