1
Walter M Marcinkiewicz, Charles W Eichelberger, Robert J Wojnarowski: Compact high density interconnect structure. General Electric Company, Marvin Snyder, August 31, 1993: US05241456 (295 worldwide citation)

An improved high density interconnect structure may include electronic components mounted on both sides of its substrate or a substrate which is only as thick as the semiconductor chips which reduces the overall structure thickness to the thickness of the semiconductor chips plus the combined thickn ...


2
Marcinkiewicz Walter Marion, Eichelberger Charles William, Wojnarowski Robert John: Compact high density interconnect structure.. Gen Electric, January 8, 1992: EP0465196-A2 (6 worldwide citation)

An improved high density interconnect structure (10) may include electronic components mounted on both sides of its substrate (12) or a substrate which is only as thick as the semiconductor chips (26) which reduces the overall structure thickness to the thickness of the semiconductor chips plus the ...