1
D Matthew Landry, Richard Webb: Circuit device including rotated stacked die. Silicon Laboratories, Polansky & Associates P L L C, R Michael Reed, December 21, 2010: US07855445 (25 worldwide citation)

In a particular embodiment, a circuit device includes a first die coupled to a circuit substrate and having a substantially planar surface. The first die includes electrical contacts distributed on the substantially planar surface adjacent to at least three edges of the first die. The circuit device ...


2
D Matthew Landry, Richard Bruce Webb: Circuit device including rotated stacked die. Silicon Laboratories, Schwegman Lundberg & Woessner Pa, October 29, 2009: US20090267224-A1

In a particular embodiment, a circuit device includes a first die coupled to a circuit substrate and having a substantially planar surface. The first die includes electrical contacts distributed on the substantially planar surface adjacent to at least three edges of the first die. The circuit device ...