1
Robert Smolley: Backplane interconnection system. TRW, James M Steinberger, Ronald L Taylor, May 28, 1991: US05019945 (38 worldwide citation)

A backplane interconnection system for interconnecting an array of electronic components, such as integrated-circuit (IC) chip packages mounted on multilayer printed circuit boards. The backplane interconnection system includes an interface board and one or more interconnecting circuit board and a p ...


2
Chad William Morgan, Masayuki Aizawa, Arash Behziz, Brian Patrick Costello, Nathan Lincoln Tracy, Michael David Herring: Printed circuit and circuit board assembly configured for quad signaling. TE CONNECTIVITY CORPORATION, TYCO ELECTRONICS JAPAN G K, March 27, 2018: US09930772 (3 worldwide citation)

Printed circuit includes a planar substrate having opposite sides and a thickness extending therebetween. The sides extend parallel to a lateral plane. The printed circuit also includes a plurality of conductive vias extending through the planar substrate in a direction that is perpendicular to the ...


3
Hassan Fallah Adl, Edoardo Campini, David Formisano: Backplane interconnection system and method. Intel Corporation, Grossman Tucker Perreault & Pfleger PLLC, December 8, 2009: US07631133 (1 worldwide citation)

An apparatus, method, computer program product, integrated circuit and system that include a backplane that provides direct and indirect connections among a plurality of slots in communication with the backplane. The backplane is also complies with a telecommunication architecture specification. The ...


4
Vito Basile, Irene Fassi, Gianluca Guadagno: Interconnection systems between signal switching circuit boards. CONSIGLIO NAZIONALE DELLE RICERCHE, Arent Fox, August 8, 2017: US09726833

An optical interconnection assembly for the mutual connection of a plurality of signal switching circuit boards that may be coupled to a common planar support, backplane, includes a planar support frame, adapted to receive an ordered arrangement of connectors, which includes a series of first connec ...


5
JIA GONGXIAN, LIU WEIXIA, WANG ZEWEN: SYSTÈME DINTERCONNEXION DE FOND DE PANIER OPTIQUE ET DISPOSITIF DE COMMUNICATION, OPTISCHES RÜCKWANDLEITERPLATTEN-VERNETZUNGSSYSTEM UND KOMMUNIKATIONSVORRICHTUNG, OPTICAL BACKPLANE INTERCONNECTION SYSTEM AND COMMUNICATION DEVICE. HUAWEI TECH, October 17, 2012: EP2511744-A1

Embodiments of the present invention provide an optical backplane interconnection system and a communication device. The optical backplane interconnection system includes a backplane, a front board, a rear board and a connector. The front board and the rear board locate on two sides of the backplane ...


6
Richard H Garrett, Richard A Elco, Timothy A Lemke: Air dielectric backplane interconnection system. Woodcock Washburn, September 12, 2002: US20020125967-A1

An air dielectric backplane interconnection system is disclosed. The interconnection system disclosed is a high speed backplane interconnection system having a plurality of conductor matched impedance transmission line elements and an air dielectric surrounding the plurality of transmission line ele ...


7
Hassan Fallah Adl, Edoardo Campini, David Formisano: Backplane interconnection system and method. Grossman Tucker Perreault & Pfleger PLLC, PortfolioIP, October 4, 2007: US20070233927-A1

An apparatus, method, computer program product, integrated circuit and system that include a backplane that provides direct and indirect connections among a plurality of slots in communication with the backplane. The backplane is also complies with a telecommunication architecture specification. The ...


8
Timothy A Lemke, Richard A Elco: High speed, controlled impedance air dielectric electronic backplane systems. Roberts Abokhair & Mardula, November 22, 2007: US20070268087-A9

A novel backplane interconnection system that is useful in the telecommunication and data process industries for ultra high speed backplane systems. It is capable of transmitting digital signals with bandwidths of 10 GHz and beyond. The invention provides high performance at a low cost of manufactur ...


9
Timothy A Lemke, Richard A Elco: High speed, controlled impedance air dielectric circuit modules for electronic backplane systems. Roberts Abokhair & Mardula, June 19, 2003: US20030112091-A1

A novel backplane interconnection system that is useful in the telecommunication and data process industries for ultra high speed backplane systems. It is capable of transmitting digital signals with bandwidths of 10 GHz and beyond. The invention provides high performance at a low cost of manufactur ...


10
Gongxian JIA, Weixia LIU, Zewen WANG: Optical backplane interconnection system and communication device. Huawei Technologies, August 23, 2012: US20120213469-A1

Embodiments of the present invention provide an optical backplane interconnection system and a communication device. The optical backplane interconnection system includes a backplane, a front board, a rear board and a connector. The front board and the rear board locate on two sides of the backplane ...