Back-face And Edge Interconnects For Lidded Package (1 - 3 of 3 results)

1

Belgacem Haba Belgacem (Bel) Haba
Robert Burtzlaff, Belgacem Haba, Giles Humpston, David B Tuckerman, Michael Warner, Craig S Mitchell: Back-face and edge interconnects for lidded package. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 29, 2007: US07224056 (27 worldwide citation)

A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and ...

2

Belgacem Haba Belgacem (Bel) Haba
Robert Burtzlaff, Belgacem Haba, Giles Humpston, David B Tuckerman, Michael Warner, Craig S Mitchell: Back-face and edge interconnects for lidded package. Tessera, Tessera, LERNER DAVID et al, May 3, 2007: US20070096295-A1

A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and ...

3

Belgacem Haba Belgacem (Bel) Haba
Robert Burtzlaff, Belgacem Haba, Giles Humpston, David B Tuckerman, Michael Warner, Craig S Mitchell: Back-face and edge interconnects for lidded package. Tessera, Lerner David Litenberg Krumholz & Mentlik, April 28, 2005: US20050087861-A1

A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and ...