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RAMAN Vijay Immanuel, RITTIG Frank, LI Yuzhuo, Chiu Wei Lan William: COMPOSITION DE POLISSAGE AQUEUSE ET PROCÉDÉ POUR POLISSAGE CHIMIQUE-MÉCANIQUE DE SUBSTRATS AYANT DES COUCHES DIÉLECTRIQUES À FAIBLE K STRUCTURÉES OU NON STRUCTURÉES, AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES HAVING PATTERNED OR UNPATTERNED LOW-K DIELECTRIC LAYERS. BASF SE, RAMAN Vijay Immanuel, RITTIG Frank, LI Yuzhuo, Chiu Wei Lan William, BASF, April 12, 2012: WO/2012/046179 (3 worldwide citation)

An aqueous polishing composition comprising (A) abrasive particles and (B) an amphiphilic nonionic surfactant selected from the group consisting of water-soluble or water-dispersible surfactants having (b1) hydrophobic groups selected from the group consisting of branched alkyl groups having 10 to 1 ...


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Shyam Sundar Venkataraman, Eason Yu Shen Su, Arend Jouke Kingma, Bastian Marten Noller: Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films. BASF SE, Oblon McClelland Maier & Neustadt L, December 20, 2016: US09524874

An aqueous polishing composition comprising (A) abrasive ceria particles and (B) amphiphilic nonionic surfactants selected water-soluble and water-dispersible, linear and branched polyoxyalkylene blockcopolymers of the general formula I: R[(B1)m/(B2)nY]p (I), wherein the indices and the variables ha ...


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Vijay Immanuel Raman, Frank Rittig, Yuzhuo Li, Wei Lan William Chiu: Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers. BASF SE, Oblon McClelland Maier & Neustadt L, June 30, 2015: US09070632

An aqueous polishing composition comprising (A) abrasive particles and (B) an amphiphilic nonionic surfactant selected from the group consisting of water-soluble or water-dispersible surfactants having (b1) hydrophobic groups selected from the group consisting of branched alkyl groups having 10 to 1 ...


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