1
Silvan Thuerlemann: Apparatus for mounting semiconductors. ESEC Trading, Thelen Reid & Priest, David B Ritchie, December 12, 2006: US07146718 (6 worldwide citation)

When mounting semiconductor chips, the semiconductor chips are presented on a wafer table where they are picked one after the other by a pick and place system, transported and placed onto a substrate that rests on a supporting surface of a substrate table. The wafer table is aligned diagonally to th ...


2
Dieter Vischer: Apparatus for mounting semiconductors. ESEC Trading, Thelen Reid & Priest, David B Ritchie, October 17, 2006: US07120995 (3 worldwide citation)

An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table for presenting the semiconductor chips, a substrate table and a pick and place system with a bondhead with a chip gripper. Part of the wafer table is located underneath the substr ...


3
Vischer Dieter: Method and apparatus for mounting semiconductors. Unaxis Int Trading, January 4, 2006: EP1612843-A1

During mounting of semiconductor chips (5) on substrate (2) several substrate positions (21) for chips are located in rows (22,23,24) next to each other. Chips, sticking to foil, are supplied on wafer table and loosening of chip from foil is supported by ejector (6). Pick and place implement (7) rec ...


4
Dieter Vischer: Apparatus for mounting semiconductors. David B Ritchie, Thelen Reid & Priest, December 9, 2004: US20040246794-A1

An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table for presenting the semiconductor chips, a substrate table and a Pick and Place system with a bondhead with a chip gripper. Part of the wafer table is located underneath the substr ...


5
Silvan Thuerlemann: Apparatus for mounting semiconductors. David B Ritchie, Thelen Reid & Priest, January 20, 2005: US20050011067-A1

With the mounting of semiconductor chips onto a substrate, the semiconductor chips are presented on a wafer table where they are picked one after the other by a Pick and Place system, transported and placed onto the substrate that rests on a supporting surface of a substrate table. The wafer table i ...


6
Vischer Dieter: Apparatus for mounting semiconductors. Esec Trading, xie lina gu gongxia, February 2, 2005: CN200410048504

An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table (5) for presenting the semiconductor chips (6), a substrate table (2) and a Pick and Place system (1) with a bondhead (20) with a chip gripper (21). Part of the wafer table (5) is ...


7
Thuerlemann Silvan: Apparatus for mounting semiconductors. Esec Trading, zhong qiang gu huimin, February 2, 2005: CN200410045751

With the mounting of semiconductor chips onto a substrate (3), the semiconductor chips (2) are presented on a wafer table (4) where they are picked one after the other by a Pick and Place system (7), transported and placed onto the substrate (3) that rests on a supporting surface (9) of a substrate ...


8
Thuerlemann Silvan: Apparatus for mounting semiconductors. Esec Trading, April 21, 2005: TWI231561

With the mounting of semiconductor chips onto a substrate (3), the semiconductor chips (2) are presented on a wafer table (4) where they are picked one after the other by a Pick and Place system (7), transported and placed onto the substrate (3) that rests on a supporting surface (9) of a substrate ...


9
Vischer Dieter: Apparatus for mounting semiconductors. Esec Trading, August 1, 2005: TWI237297

An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table (5) for presenting the semiconductor chips (6), a substrate table (2) and a Pick and Place system (1) with a bondhead (20) with a chip gripper (21). Part of the wafer table (5) is ...


10
Vischer Dieter: Apparatus for mounting semiconductors. Esec Trading, February 1, 2005: TW200504803

An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table (5) for presenting the semiconductor chips (6), a substrate table (2) and a Pick and Place system (1) with a bondhead (20) with a chip gripper (21). Part of the wafer table (5) is ...