1
Ichiro Katayama, Masatami Iwaki, Kazumi Ikeda: Apparatus and method for chamfering wafer. Tokyo Seimitsu, David S Safran, Nixon Peabody, July 31, 2001: US06267648 (57 worldwide citation)

A grindstone and a wafer are rotated at high speeds in the same direction. The rotating wafer is slowly moved toward the rotating grindstone to thereby gradually chamfer the periphery of the wafer.


2
Kohei Toyama: Apparatus and method for chamfering wafer with loose abrasive grains. Shin Estu Handotai, Oliff & Berridge, August 31, 1999: US05944584 (8 worldwide citation)

Dispersion of cracks in a crack layer across a ground surface is reduced in chamfering a semiconductor silicon wafer. The semiconductor silicon wafer is clamped by a clamp device, which is freely rotated and a polisher having the shape of a ring built in a polishing device, which is freely rotated, ...


3
Toyama Kohei: Apparatus and method for chamfering wafer with loose abrasive grains. Shinetsu Handotai, March 4, 1998: EP0826459-A1 (8 worldwide citation)

Dispersion of cracks in a crack layer across a ground surface is reduced in chamfering a semiconductor silicon wafer (W). The semiconductor silicon wafer W is clamped by a clamp device (1), which is freely rotated and a polisher (8) having the shape of a ring built in a polishing device (2), which i ...


4
Ichiro Katayama, Masatami Iwaki, Kazumi Ikeda: Apparatus and method for chamfering wafer. Tokyo Seimitsu, David S Safran, Nixon Peabody, August 13, 2002: US06431961 (6 worldwide citation)

A grindstone and a wafer are rotated at high speeds in the same direction. The rotating wafer is slowly moved toward the rotating grindstone to thereby gradually chamfer the periphery of the wafer.


5
Katayama Ichiro, Iwaki Masatami, Ikeda Kazumi: Apparatus and method for chamfering wafer. Tokyo Seimitsu, November 24, 1999: EP0958889-A2 (1 worldwide citation)

A grindstone and a wafer (W) are rotated at high speeds in the same direction. The rotating wafer (W) is slowly moved toward the rotating grindstone (108) to thereby gradually chamfer the periphery of the wafer (W).


6
Katayama Ichiro, Iwaki Masatami, Ikeda Kazumi: Apparatus and method for chamfering wafer. Tokyo Seimitsu, December 21, 2000: TW415879

A grindstone and a wafer are rotated at high speeds in the same direction. The rotating wafer is slowly moved toward the rotating grindstone to thereby gradually chamfer the periphery of the wafer.


7


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