Skoultchi Martin M: Adhesive and sealant compositions. National Starch and Chemical Corporation, April 29, 1975: US3880956 (23 worldwide citation)

Anaerobic curing compositions useful as anaerobic adhesives and sealants are described, said compositions comprising mixtures of polymerizable acrylic and substituted acrylic monomers and diazonium salts at latent polymerization catalysts therefor.

Gerace Michael J, Gerace Janet M: Hot plastisol compositions.. Gerace Michael J, Gerace Janet M, August 21, 1991: EP0442178-A1 (21 worldwide citation)

Thermally stable hot applied plastisol compositions are especially useful in the assembly of metal parts. The compositions have adhesive and sealant qualities which allow them to be used in automotive assembly plants. Compositions of the invention comprise as major ingredients finely divided polyvin ...

Frauenglass Elliott, Cass William E: Anaerobic adhesive and sealant compositions in nonflowable form. Loctite Corporation, December 7, 1971: US3625875 (20 worldwide citation)

Sheets, such as films and gasket material, and coatings which are adhesive in nature can be made from a thermoplastic polymer by plasticizing the polymer with an anaerobic adhesive, i.e., a mixture of a polymerizable liquid acrylate ester monomer and a peroxy polymerization initiator.

Richard J Boyce, Terence A Cooper: Hot melt adhesive composition. E I Du Pont de Nemours and Company, August 18, 1981: US04284542 (18 worldwide citation)

Hot melt adhesive and sealant compositions based on alkali metal ionomers of random copolymers of ethylene, methyl acrylate, and one or more carboxylated monomers have improved high temperature viscosity stability when the composition contains 0.05-10 phr of ammonium polyphosphate.

Joseph V Koleske, Donald F Smith Jr, Robert J Weber Jr: (N-substituted carbamoyloxy)alkanoyloxyalkyl acrylate polymers and compositions made therefrom. Union Carbide Corporation, Jean B Mauro, July 11, 1989: US04847329 (18 worldwide citation)

This invention is directed to polymers (including oligomers) that contain (N-substituted carbamoyloxy)alkanoyloxyalkyl acrylates, to a process for their preparation by reacting the carbamoyloxy alkanoyloxyalkyl acrylates with other ethylenically unsaturated monomers, and to coating, ink, adhesive, a ...

Glenn R Himes, Bridget A Spence, Ronald J Hoxmeier, Steven S Chin: Dissimilar arm asymmetric radical or star block copolymers for adhesives and sealants. Shell Oil Company, Donald F Haas, January 23, 1996: US05486574 (17 worldwide citation)

Radial or star asymmetric block copolymer of the following formulae and an improved tape assembly using the copolymers and improved adhesive and sealant compositions containing them


Joseph V Koleske, Donald F Smith, Robert J Weber: Novel polymers and crosslinked compositions made therefrom. Union Carbide Corporation, J B Mauro, July 14, 1987: US04680361 (16 worldwide citation)

This invention is directed in general to polymers (including oligomers) that contain carboxyl-terminated lactone acrylates, to a process for their preparation, and to coating, ink, adhesive, and sealant compositions (including the cured coatings, inks, adhesives, and sealants) that are obtained by c ...

Hans Haas, Matthew Burdzy: Polymerizable compositions in non-flowable forms. Loctite Corporation, Steven C Bauman, September 17, 2002: US06451927 (16 worldwide citation)

The present invention relates to adhesive and sealant compositions in non-flowable form. More particularly, the present invention relates to non-flowable adhesive and sealant compositions which are particularly useful in the threadlocking and sealing applications and which can be packaged in a conve ...

Jerome A Frankeny, Richard F Frankeny, Joseph LaTorre: Chip attach and sealing method. International Business Machines Corporation, Mark E McBurney, January 18, 1994: US05279711 (15 worldwide citation)

A method of fabricating a substrate module is provided that includes cavities of a diameter and depth which take into account the statistical variance in the dimensions of C4 solder balls. By constructing cavities with the proper dimensions, electrical connection between the chip and substrate, via ...