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Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Belgacem Haba, Piyush Savalia: Active chip on carrier or laminated chip having microelectronic element embedded therein. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 3, 2013: US08598695 (24 worldwide citation)

A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within the cavity. The first chip may have vias extending from the cavity to the front surface and via conductors within these vias serving to connec ...


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Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Belgacem Haba, Piyush Savalia: Active chip on carrier or laminated chip having microelectronic element embedded therein. Tessera Research, January 26, 2012: US20120018895-A1

A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within the cavity. The first chip may have vias extending from the cavity to the front surface and via conductors within these vias serving to connec ...


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Vage Oganesian, Belgacem Haba, Craig Mitchell, Ilyas Mohammed, Piyush Savalia: Microelectronic elements with post-assembly planarization. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 8, 2018: US09966303

A microelectronic unit can include a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can also include a ...


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Vage Oganesian, Belgacem Haba, Craig Mitchell, Ilyas Mohammed, Piyush Savalia: Microelectronic elements with post-assembly planarization. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 23, 2017: US09659812

A microelectronic unit can include a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can also include a ...


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Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Belgacem Haba, Piyush Savalia: Active chip on carrier or laminated chip having microelectronic element embedded therein. Tessera, Haynes and Boone, May 31, 2016: US09355959

A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within the cavity. The first chip may have vias extending from the cavity to the front surface and via conductors within these vias serving to connec ...


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OGANESIAN Vage, MOHAMMED Llyas, MITCHELL Craig, HABA Belgacem, SAVALIA Piyush: Puce active sur support ou puce stratifiée dans laquelle est incorporé un élément microélectronique, Active chip on carrier or laminated chip having microelectronic element embedded therein. Tessera, OGANESIAN Vage, MOHAMMED Llyas, MITCHELL Craig, HABA Belgacem, SAVALIA Piyush, NEFF Daryl K, January 26, 2012: WO/2012/011929

A structure including a first semiconductor chip 20 with front and rear surfaces 24, 26 and a cavity 36 in the rear surface. A second semiconductor chip 70 is mounted within the cavity. The first chip 20 may have vias 48 extending from the cavity to the front surface and via conductors 54 within the ...


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ACTIVE CHIP ON CARRIER OR LAMINATED CHIP HAVING MICROELECTRONIC ELEMENT EMBEDDED THEREIN. Tessera, July 24, 2014: US20140203452-A1

A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within the cavity. The first chip may have vias extending from the cavity to the front surface and via conductors within these vias serving to connec ...


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ACTIVE CHIP ON CARRIER OR LAMINATED CHIP HAVING MICROELECTRONIC ELEMENT EMBEDDED THEREIN. August 11, 2016: US20160233165-A1

A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within the cavity. The first chip may have vias extending from the cavity to the front surface and via conductors within these vias serving to connec ...


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MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION. September 7, 2017: US20170256443-A1

A microelectronic unit can include a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can also include a ...


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ACTIVE CHIP ON CARRIER OR LAMINATED CHIP HAVING MICROELECTRONIC ELEMENT EMBEDDED THEREIN. May 10, 2018: US20180130746-A1

A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within the cavity. The first chip may have vias extending from the cavity to the front surface and via conductors within these vias serving to connec ...