1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Semiconductor module with imbedded heat spreader. Rambus, Pennie & Edmonds, September 10, 2002: US06449159 (117 worldwide citation)

The invention provides a semiconductor module comprising a heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. The leads may form part of a flexible circuit at least partiall ...


2
Fred Thomas
Philip M Walker, Fred C Thomas, Bryce C Wemple, Kirk N Ray: Storage device protection system. Hewlett Packard Development Company, March 17, 2009: US07505263

A storage device protection system. At least some of the illustrative embodiments are systems comprising a processor, a storage device electrically coupled to the processor, and a protection system. The protection system comprises an enclosure within which the storage device is positioned, and a foa ...


3
John R Pastore, Victor K Nomi, Howard P Wilson: Pad array semiconductor device with thermal conductor and process for making the same. Motorola, Patricia S Goddard, February 8, 1994: US05285352 (340 worldwide citation)

A pad array semiconductor device (35) includes a thermal conductor (28) integrated into a circuitized substrate (14). A semiconductor die (12) is mounted on the substrate overlying the thermal conductor to establish a thermal path away from the die. The thermal conductor may also be covered or surro ...


4
John K Woodman: Three dimensional integrated circuit package. Flehr Hohbach Test Albritton & Herbert, May 14, 1991: US05016138 (279 worldwide citation)

This invention discloses a three-dimensional, high density package for integrated circuits for which integrated circuits are placed onto substrate layers and then stacked together. Techniques for interconnecting the layers to one another and for connecting the layers to external circuitry are also d ...


5
Carl A Inpyn: Package for electronic components. Control Products, Michael B Einschlag, June 16, 1992: US05122925 (251 worldwide citation)

Package for electronic components of a switch, which switch includes sensing components such as thermistor, measuring components, and output-control components, some of which components are relatively highly power-dissipative. A first portion of the switch supports the thermistor in a bushing wherei ...


6
Qing Ma, Chun Mu, Harry Fujimoto, John Carruthers, Jian Li, Chuanbin Pan: Structures and processes for fabricating moisture resistant chip-on-flex packages. Intel Corporation, Robert G Winkle, November 28, 2000: US06154366 (245 worldwide citation)

A chip-on-flex package which includes at least one moisture barrier layer to prevent metal corrosion and delamination of flex component layers. An exemplary microelectronic package includes a microelectronic die having an active surface and at least one side, wherein the microelectronic die active s ...


7
John B Riley: Attachment assembly for integrated circuits. National Semiconductor Corporation, John L Maxin, January 5, 1999: US05856911 (244 worldwide citation)

An integrated circuit package has a top die attach area and a bottom heat spreader thermally coupled to the die for conducting heat generated by the die through a thermal interface in the main circuit board to a heat sink or heat pipe mounted underneath the main circuit board. The preferred thermal ...


8
William P Stearns, Nozar Hassanzadeh: Ball grid array package and method using enhanced power and ground distribution circuitry. Texas Instruments Incorporated, Wade James Brady III, Frederick J Telecky Jr, December 12, 2000: US06160705 (241 worldwide citation)

A structure (10) is provided that is fabricated as a ball grid array substrate that includes a substrate dielectric (14), a power ring (18), a ground ring (20), a plurality of traces, and a second metal layer (16). The substrate dielectric (14) includes a first side, a second side, and a cavity form ...


9
Richard C Chu, Michael J Ellsworth Jr, Roger R Schmidt, Robert E Simons: Method and system for cooling electronics racks using pre-cooled air. International Business Machines Corporation, Andrew J Wojnicki Jr, November 16, 2004: US06819563 (236 worldwide citation)

Augmenting air cooling of electronics systems using a cooling fluid to cool air entering the electronics system, and to remove a portion of the heat dissipated by the electronics. A cooled electronics system includes a frame, electronics drawers, fans or air moving devices, and an inlet heat exchang ...


10
William H Whitted, Gerald Aigner: Modular data center. Google, Jung hua Kuo, October 9, 2007: US07278273 (235 worldwide citation)

Modular data centers with modular components suitable for use with rack or shelf mount computing systems, for example, are disclosed. The modular center generally includes a modular computing module including an intermodal shipping container and computing systems mounted within the container and con ...