1
Fred Thomas Fred Thomas
Fred C Thomas, Max Chen, Arthur Sandoval, Travis Lee, Matthew Peterson: Drive carrier for computer systems. Hewlett Packard Development Company, December 29, 2009: US07639492 (11 worldwide citation)

A drive carrier for computer systems. At least some of the illustrative embodiments are drive carriers comprising a first suspension member that defines a first side of the drive carrier, a second suspension member that defines a second side of the drive carrier (the second suspension member configu ...


2
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization using duplicate sets of terminals for wirebond assemblies without windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659141 (30 worldwide citation)

A microelectronic assembly can include a microelectronic package connected with a circuit panel. The package has a microelectronic element having a front face facing away from a substrate of the package, and electrically connected with the substrate through conductive structure extending above the f ...


3
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for wirebond assemblies without windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659142 (29 worldwide citation)

A microelectronic assembly can include a circuit panel having first and second surfaces and panel contacts at each surface, and first and second microelectronic packages having terminals mounted to the panel contacts at the first and second surfaces, respectively. The circuit panel can electrically ...


4
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for wirebond assemblies without windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659143 (29 worldwide citation)

A microelectronic package can include a substrate and a microelectronic element having a rear face facing a first surface of the substrate, a front face, and a column of element contacts extending in a first direction. The microelectronic element can include stacked electrically interconnected semic ...


5
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659140 (29 worldwide citation)

A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with at least one external component. The substrate can h ...


6
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization using duplicate sets of terminals for wirebond assemblies without windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, February 18, 2014: US08653646 (29 worldwide citation)

A microelectronic element having a memory storage array has a front face facing away from a substrate of a microelectronic package, and is electrically connected with the substrate through conductive structure extending above the front face. First terminals are disposed at locations within first and ...


7
Fred Thomas
Fred C Thomas, Paul Boerger: Noise reduction in a system. Hewlett Packard Development Company, December 27, 2011: US08085948 (24 worldwide citation)

A system comprises a plurality of storage drives coupled to logic. The logic implements a noise-reducing feature selected from a group consisting of a first feature that limits system performance based on a level of ambient noise, a second feature that staggers access transactions among said storage ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Kishor Desai: Low CTE interposer. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, July 15, 2014: US08780576 (3 worldwide citation)

An interconnection component includes a first support portion has a plurality of first conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent a first surface and a second end adjacent a second surface. A second support porti ...


9
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Wael Zohni, Richard Dewitt Crisp: Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics. Tessera, Lerner David Littenberg Krumholz & Mentlik, October 8, 2013: US08553420

A microelectronic assembly includes a dielectric element having oppositely-facing first and second surfaces and one or more apertures extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element having a rear surface and a front s ...


10
Steven Jobs
Steve Jobs, Anthony M Fadell, Jonathan P Ive: Highly portable media device. Apple, Beyer Law Group, February 15, 2011: US07889497 (4 worldwide citation)

An improved portable media device and methods for operating a media device are disclosed. According to one aspect, the portable media device can also function as a solid-state drive for data storage. The form factor of the portable media device can be hand-held or smaller, such that it is highly por ...