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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Memory module. Rambus, Morgan Lewis & Bockius, April 13, 2004: US06721189 (23 worldwide citation)

The memory module includes a substantially rigid first circuit board having at least one memory chip disposed thereon. The memory module also includes a substantially rigid second circuit board having an array of electrical contact points disposed on a planar surface thereof. A flexible connector el ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Memory module. Rambus, Morgan Lewis & Bockius, March 14, 2006: US07012812 (11 worldwide citation)

The memory module includes a substantially rigid first circuit board having at least one memory chip disposed thereon. The memory module also includes a substantially rigid second circuit board having an array of electrical contact points disposed on a planar surface thereof. A flexible connector el ...


3
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Belgacem Haba, Wael Zohni: Co-support component and microelectronic assembly. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, September 30, 2014: US08848391

A component is configured for connection with a microelectronic assembly having terminals and a microelectronic element connected with the terminals. The component includes a support structure bearing conductors configured to carry command and address information, and a plurality of contacts coupled ...


4
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Belgacem Haba, Wael Zohni: Co-support module and microelectronic assembly. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, September 30, 2014: US08848392

A module is configured for connection with a microelectronic assembly having terminals and a microelectronic element. The module includes a circuit panel bearing conductors configured to carry command and address information, co-support contacts coupled to the conductors, and module contacts coupled ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Wael Zohni, Richard Dewitt Crisp: Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics. Tessera, Lerner David Littenberg Krumholz & Mentlik, October 8, 2013: US08553420

A microelectronic assembly includes a dielectric element having oppositely-facing first and second surfaces and one or more apertures extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element having a rear surface and a front s ...


6
Paul T Lin: Three-dimensional multi-chip pad array carrier. Motorola, James L Clingan Jr, June 22, 1993: US05222014 (486 worldwide citation)

A stackable three-dimensional multi-chip module (MCM) is provided whereby each level of chip carrier is interconnected to another level of chip carrier through reflowing of solder balls pre-bumped onto each carrier. Each level of chip carrier, except for the top carrier, has solder balls on both top ...


7
Michael D Rostoker: Multi-chip semiconductor arrangements using flip chip dies. LSI Logic Corporation, Hongiman Miller Schwartz and Cohn, March 21, 1995: US05399898 (337 worldwide citation)

Multi-chip, multi-tier semiconductor arrangements based upon single and double-sided flip-chips are described. The double-sided flip chips provide raised bump contact means on both major surfaces of a die and provided connections to internal signals within the die, feed through connections between c ...


8
Charles T Perkins, Gustav Schrottke: Formulation of multichip modules. International Business Machines Corporation, Mark E McBurne, August 24, 1993: US05239448 (224 worldwide citation)

A method of reducing the area of MCMs that are integral to a flexible carrier is provided. A locally complex area, i.e. multilayer MCM carrier is constructed on a flex carrier, along with other components to form a subsystem. The flex carrier provides the interface between the MCM and the system tha ...


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Masahide Tokuda, Takeshi Kato, Hiroyuki Itoh, Masayoshi Yagyu, Yuuji Fujita, Mitsuo Usami: Chip connection structure having diret through-hole connections through adhesive film and wiring substrate. Hitachi, Antonelli Terry Stout & Kraus, February 9, 1999: US05870289 (218 worldwide citation)

A structure for connecting an integrated circuit chip to a wiring substrate which implements high-density packaging, high-density connection, high-speed signal transmission, and low cost. An integrated circuit is connected to a wiring substrate by means of flip-chip die bonding using an adhesive fil ...


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Robert F Wallace, Eliyahou Harari: Compact mechanism for removable insertion of multiple integrated circuit cards into portable and other electronic devices. SanDisk Corporation, Majestic Parsons Siebert & Hsue, August 3, 1999: US05933328 (199 worldwide citation)

Two integrated circuit cards, such as those having semiconductor memory for storing user identification codes and/or data, are removably inserted into an opening of a host electronic device by means of a carrier that causes electrical contacts of the cards to be properly aligned with mating device c ...