1
Fred Thomas Fred Thomas
Fred C Thomas, Max Chen, Arthur Sandoval, Travis Lee, Matthew Peterson: Drive carrier for computer systems. Hewlett Packard Development Company, December 29, 2009: US07639492 (7 worldwide citation)

A drive carrier for computer systems. At least some of the illustrative embodiments are drive carriers comprising a first suspension member that defines a first side of the drive carrier, a second suspension member that defines a second side of the drive carrier (the second suspension member configu ...


2
Fred Thomas Fred Thomas
Bruno Richet, Fred Charles Thomas, Arthur Sandoval, Daniel Francis Kennedy: Hard-disk Drive Insertion. July 21, 2011: US20110173805-A1

A hard-disk drive insertion mechanism includes carrier mechanism that moves longitudinally with the hard-disk drive as it is being inserted toward said electrical connector. The carrier mechanism includes engagement features for engaging the hard-disk drive as it is being inserted. The insertion mec ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Semiconductor module with imbedded heat spreader. Rambus, Pennie & Edmonds, September 10, 2002: US06449159 (116 worldwide citation)

The invention provides a semiconductor module comprising a heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. The leads may form part of a flexible circuit at least partiall ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Sayeh Khalili, Donald R Mullen, Nader Gamini: Multi-channel memory architecture. Rambus, Lee & Hayes PLLC, February 8, 2005: US06853557 (114 worldwide citation)

A memory architecture includes a first substrate containing multiple memory devices and a first channel portion extending across the first substrate. The architecture further includes a second substrate containing multiple memory devices and a second channel portion extending across the second subst ...


5
Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba: Components with conductive solder mask layers. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 11, 2001: US06329605 (98 worldwide citation)

A component for forming solder connections includes a diectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said surface, and an electrically conductive potential plane element having a non solder-wettable surface overlying the surface of the base in prox ...


6
Belgacem Haba Belgacem (Bel) Haba
Ravindranath T Kollipara, David Nguyen, Belgacem Haba: Clock routing in multiple channel modules and bus systems. Rambus, Lee & Hayes PLLC, July 8, 2003: US06590781 (52 worldwide citation)

An apparatus is provided, which includes a memory interface circuit, a clock signal generating circuit, and a plurality of memory circuits. The memory circuits are operatively coupled and arranged in an order on a plurality of memory modules, such that the memory module positioned at the beginning o ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard E Perego, David Nguyen, Billy W Garrett Jr, Ely Tsern, Craig E Hampel, Wai Yeung Yip: Multiple channel modules and bus systems using same. Rambus, July 20, 2004: US06765800 (42 worldwide citation)

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


8
Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Philip Damberg, John B Riley, David Gibson, Young Gon Kim, Belgacem Haba, Vernon Solberg: Stacked microelectronic assemblies. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 12, 2006: US07149095 (41 worldwide citation)

A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a plurality of second contacts. Each subassembly also has at least one microelectronic element assembled to the ...


9
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Anthony B Faraci: Method of making a connection to a microelectronic element. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 23, 2002: US06374487 (41 worldwide citation)

A connector for microelectronic elements includes a sheetlike dielectric layer having a plurality of through holes desirably arranged in a rectangular grid pattern. Each hole is provided on one major surface with a generally laminar contact having at least one projection extending inwardly over the ...


10
Belgacem Haba Belgacem (Bel) Haba
Donald V Perino, Belgacem Haba, Sayeh Khalili: Multiple channel modules and bus systems using same. Rambus, April 8, 2003: US06545875 (40 worldwide citation)

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.



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