1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Wael Zohni, Richard Dewitt Crisp: Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics. Tessera Research, April 19, 2012: US20120092832-A1

A microelectronic assembly includes a dielectric element having oppositely-facing first and second surfaces and one or more apertures extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element having a rear surface and a front s ...


2
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Craig Mitchell, Ilyas Mohammed, Piyush Savalia: Microelectronic elements with post-assembly planarization. Tessera Research, January 26, 2012: US20120020026-A1

A microelectronic unit includes a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can include a microele ...


3
Nathaniel Brese
Edit Szocs, Felix J Schwager, Thomas Gaethke, Nathaniel E Brese, Michael P Toben: Indium compositions. Rohm and Haas Electronic Materials, May 5, 2011: US20110103022-A1

Indium compositions including hydrogen suppressor compounds and methods of electrochemically depositing indium metal from the compositions onto substrates are disclosed. Articles made with the indium compositions are also disclosed.


4
David Sherrer
Jean Marc Rollin, David W Sherrer: Integrated electronic components and methods of formation thereof. Sherr & Vaughn Pllc, November 25, 2010: US20100296252-A1

Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromag ...


5
Michael Lin 林立
吴建安, 朱江荣: 逆变器功率单元的组装结构及使用其的模块化功率单元. 深圳市英威腾电气股份有限公司, 何青瓦, 深圳市威世博知识产权代理事务所(普通合伙), January 20, 2010: CN200920135835.2

一种逆变器功率单元的组装结构,包括电容、功率模块、散热器以及风扇。其中,所述散热器包括基板以及与基板相连的多条齿片。所述电容设置在所述功率模块上。所述功率模块安装在所述基板的外表面。所述风扇安装在齿片与基板相对的端部,且与所述功率模块平行设置。本实用新型通过电容、功率模块、散热器以及风扇的依次顺序放置的立体化结构设计,使结构更为紧凑,安装面积小,且,采用风扇对齿片垂直吹风的模式,散热效果好,同时提高了功率模块的使用率和可靠性。另外,本实用新型还提供一种使用该组装结构设计的模块化功率单元。


6
Eb Eshun
Douglas D COOLBAUGH, Ebenezer E ESHUN, Terence B HOOK, Robert M RASSEL, Edmund J SPROGIS, Anthony K STAMPER, William J MURPHY: Heat sink for integrated circuit devices. International Business Machines Corporation, Greenblum & Bernstein, January 24, 2008: US20080019101-A1

A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator i ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Semiconductor Module with Serial Bus Connection to Multiple Dies. Morgan Lewis & Bockius Rambus, October 4, 2007: US20070230134-A1

The semiconductor module includes a heat spreader, first and second sets of two semiconductors that include circuitry and are thermally coupled to the heat spreader, first and second termination resistors, and first and second sets of electrically conductive leads. The first termination resistor is ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Semiconductor Module with Serial Bus Connection to Multiple Dies. Morgan Lewis & Bockius Rambus, October 4, 2007: US20070230139-A1

The semiconductor module includes a heat spreader, two semiconductors that include circuitry, a termination resistor, an array of electrical contact points, and a plurality of electrically conductive leads. The semiconductors are thermally coupled to the heat spreader. The terminator resistor is ele ...


9
Erwin Meinders
Erwin Rinaldo Meinders, Celine Catherine Sarah Nicole: Cooling assembly comprising micro-jets. Koninklijke Philips Electronics, Philips Electronics North America Corporation, Intellectual Property & Standards, July 27, 2006: US20060164805-A1

The present invention relates to a cooling assembly (100) for cooling a heat source (2), in particular electronic components 7, with a coolant (C). To achieve a high coolant efficiency enabling the cooling of high heat fluxes, and in order to avoid the occurrence of free circulation areas in the coo ...


10
Longzhi Jiang
Longzhi Jiang, Clifford Ginfrida JR, Neil Clarke, Weijun Shen, Ernst Wolfgang Stautner, Tao Zhang, Robbi McDonald: Superconducting magnet coil support with cooling and method for coil-cooling. May 3, 2012: US20120108433-A1

A superconducting magnet coil support with cooling and a method for coil cooling are provided. One superconducting coil support arrangement includes a superconducting coil and at least one support beam supporting the superconducting coil and defining a tank for storing a cooling fluid therein. The s ...