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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard E Perego, David Nguyen, Billy W Garrett Jr, Ely Tsern, Craig E Hampel, Wai Yeung Yip: Multiple channel modules and bus systems using same. Rambus, Hunton & Williams, May 24, 2005: US06898085 (38 worldwide citation)

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


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Charles A Miller: Multiple die interconnect system. FormFactor, Smith Hill & Bedell PC, Fliesler Meyer, April 19, 2005: US06882546 (75 worldwide citation)

A multiple integrated circuit (IC) die assembly includes a base IC die and secondary IC dice mounted on a surface of the base IC die. A set of protruding contacts formed on the surface of the base IC die and extending beyond the secondary IC dice link the surface of the base IC die to a printed circ ...


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Kishore K Chakravorty: Electronic assemblies and systems comprising interposer with embedded capacitors. Intel Corporation, Schwegman Lundberg Woessner & Kluth P A, November 29, 2005: US06970362 (55 worldwide citation)

To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one capacitor embedded in an interposer that lies between the die and a substrate. In an embodiment, the interposer is a multilayer ceramic structure that couples po ...


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Gordon Yu, Tony Chang, Forli Wen: Storage memory device. C One Technology Corporation, September 13, 2005: US06944028 (48 worldwide citation)

A storage memory device includes a primary body comprised of a first memory card at one side and a connection portion at the other side. Contacts are provided in the connection portion and in electrical connection with the first memory card to serve as a data transmission interface for the first mem ...


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Christopher J Kelly, Jeffrey L Krieger, Raymond P Askew: Printed circuit board routing and power delivery for high frequency integrated circuits. Intel Corporation, Trop Pruner & Hu P C, May 31, 2005: US06900992 (42 worldwide citation)

A printed circuit board includes a signal layer and a supply voltage plane layer. The signal layer includes traces to communicate signals that are not associated with regulated supply voltages. The supply voltage plane is embedded in the signal layer to supply power to multiple supply voltage pins o ...


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Sam Ziqun Zhao, Reza ur Rahman Khan, Imtiaz Chaudhry: Enhanced die-up ball grid array package with two substrates. Broadcom Corporation, Sterne Kessler Goldstein & Fox P L L C, April 5, 2005: US06876553 (27 worldwide citation)

An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second subs ...


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James W Cady, James Wilder, David L Roper, Russell Rapport, James Douglas Wehrly Jr, Jeffrey Alan Buchle: Integrated circuit stacking system and method. Staktek Group, Andrews Kurth L, September 6, 2005: US06940729 (26 worldwide citation)

The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The invention provides techniques and structures for aggregating chip scale-packaged integrated circuits (CSPs) or leaded packages with other CSPs or with monolithic or stacked leade ...


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E Michael Lunsford: Electronically-enabled housing apparatus for a computing device. palmOne, Shemwell Gregory & Courtney, March 8, 2005: US06865076 (23 worldwide citation)

An electronically-enabled encasement for a handheld computer is provided. The encasement includes an encasement portion configured to cover at least a portion of the handheld computer, including a front surface of the handheld computer providing access to a display; a spine engageable with an access ...


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Hassan Hashemi, Shiaw Chang, Roger Forse, Evan McCarthy, Trang Trinh, Thuy Tran: Multiple chip module with integrated RF capabilities. Skyworks Solutions, Farjami & Farjami, April 26, 2005: US06885561 (19 worldwide citation)

A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM i ...


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Jeffrey L Beseth, Jared S Klein, Paul J Rollheiser: Electronic equipment module apparatus and method. Garmin International, Devon A Rolf, August 9, 2005: US06927983 (15 worldwide citation)

An electronic equipment module includes a symmetrical casting with two chassis units. Each unit includes a mounting recess to receive a circuit assembly, separated by a cover applied to either unit, or both. The module is normally mounted to a unit rack, and typically has a removably attachable, re- ...