1
Charles A Miller: Multiple die interconnect system. FormFactor, Smith Hill & Bedell PC, Fliesler Meyer, April 19, 2005: US06882546 (75 worldwide citation)

A multiple integrated circuit (IC) die assembly includes a base IC die and secondary IC dice mounted on a surface of the base IC die. A set of protruding contacts formed on the surface of the base IC die and extending beyond the secondary IC dice link the surface of the base IC die to a printed circ ...


2
Kishore K Chakravorty: Electronic assemblies and systems comprising interposer with embedded capacitors. Intel Corporation, Schwegman Lundberg Woessner & Kluth P A, November 29, 2005: US06970362 (55 worldwide citation)

To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one capacitor embedded in an interposer that lies between the die and a substrate. In an embodiment, the interposer is a multilayer ceramic structure that couples po ...


3
Christopher J Kelly, Jeffrey L Krieger, Raymond P Askew: Printed circuit board routing and power delivery for high frequency integrated circuits. Intel Corporation, Trop Pruner & Hu P C, May 31, 2005: US06900992 (42 worldwide citation)

A printed circuit board includes a signal layer and a supply voltage plane layer. The signal layer includes traces to communicate signals that are not associated with regulated supply voltages. The supply voltage plane is embedded in the signal layer to supply power to multiple supply voltage pins o ...


4
Sam Ziqun Zhao, Reza ur Rahman Khan, Imtiaz Chaudhry: Enhanced die-up ball grid array package with two substrates. Broadcom Corporation, Sterne Kessler Goldstein & Fox P L L C, April 5, 2005: US06876553 (27 worldwide citation)

An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second subs ...


5
Hassan Hashemi, Shiaw Chang, Roger Forse, Evan McCarthy, Trang Trinh, Thuy Tran: Multiple chip module with integrated RF capabilities. Skyworks Solutions, Farjami & Farjami, April 26, 2005: US06885561 (19 worldwide citation)

A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM i ...


6
Eberhard Waffenschmidt: Printed circuit board. Koninklijke Philips Electronics, June 7, 2005: US06903938 (15 worldwide citation)

The invention relates to a printed circuit board comprising capacitive and inductive elements. To arrange such a printed circuit board so that it has a smaller thickness and can be manufactured cost effectively, a printed circuit board is proposed having at least one dielectric layer, on the two sid ...


7
Akihito Takano, Takahiro Iijima: Multilayer circuit board and semiconductor device using the same. Shinko Electric, Paul & Paul, May 10, 2005: US06891732 (10 worldwide citation)

A multilayer circuit board for mounting a semiconductor element thereon, comprising a core substrate of a metal material and a plurality of wiring layers stacked on either side of the core substrate, each of the stacked wiring layers being isolated from an adjacent wiring layer by an insulating laye ...


8
John L Galvagni: Multilayer electronic devices with via components. AVX Corporation, Dority & Manning P A, November 8, 2005: US06963493 (8 worldwide citation)

A method of using blind via to house electronic components within an electrical device is provided. Such a method allows for the vertical orientation of various types of passive components within a layer of a printed circuit board (PCB) or an integrated passive device (IPD). One exemplary embodiment ...


9
Dennis James Herrell: Crosstalk cancellation for integrated circuit package configuration. Advanced Micro Devices, Zagorin O Brien Graham, May 10, 2005: US06891731 (8 worldwide citation)

A technique has been developed whereby crosstalk induced in a first electrical connection by current flow at an adjacent second electrical connection is at least partially cancelled by an opposing crosstalk signal induced at an inductive coupling between electrical traces extending from or toward th ...


10
John O Wanes, David L Gauthier, Albert J Kerklaan, Kai K Ho: Component substrate for a printed circuit board and method of assembyling the substrate and the circuit board. C&D Charter Holdings, Hoffmann & Baron, November 15, 2005: US06965517 (6 worldwide citation)

The invention provides a system and method for assembling an electrical module. The module comprises a circuit board, a substrate and an electrical component carried on the substrate. The substrate is formed by a stamping process an is mounted at a location on the circuit board. The substrate forms ...