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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Sayeh Khalili, Donald R Mullen, Nader Gamini: Multi-channel memory architecture. Rambus, Lee & Hayes PLLC, February 8, 2005: US06853557 (118 worldwide citation)

A memory architecture includes a first substrate containing multiple memory devices and a first channel portion extending across the first substrate. The architecture further includes a second substrate containing multiple memory devices and a second channel portion extending across the second subst ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard E Perego, David Nguyen, Billy W Garrett Jr, Ely Tsern, Craig E Hampel, Wai Yeung Yip: Multiple channel modules and bus systems using same. Rambus, Hunton & Williams, May 24, 2005: US06898085 (38 worldwide citation)

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


3
Charles A Miller: Multiple die interconnect system. FormFactor, Smith Hill & Bedell PC, Fliesler Meyer, April 19, 2005: US06882546 (75 worldwide citation)

A multiple integrated circuit (IC) die assembly includes a base IC die and secondary IC dice mounted on a surface of the base IC die. A set of protruding contacts formed on the surface of the base IC die and extending beyond the secondary IC dice link the surface of the base IC die to a printed circ ...


4
Kishore K Chakravorty: Electronic assemblies and systems comprising interposer with embedded capacitors. Intel Corporation, Schwegman Lundberg Woessner & Kluth P A, November 29, 2005: US06970362 (55 worldwide citation)

To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one capacitor embedded in an interposer that lies between the die and a substrate. In an embodiment, the interposer is a multilayer ceramic structure that couples po ...


5
Christopher J Kelly, Jeffrey L Krieger, Raymond P Askew: Printed circuit board routing and power delivery for high frequency integrated circuits. Intel Corporation, Trop Pruner & Hu P C, May 31, 2005: US06900992 (42 worldwide citation)

A printed circuit board includes a signal layer and a supply voltage plane layer. The signal layer includes traces to communicate signals that are not associated with regulated supply voltages. The supply voltage plane is embedded in the signal layer to supply power to multiple supply voltage pins o ...


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Chia Ming Hsieh: Ball grid array package with an electromagnetic shield connected directly to a printed circuit board. Benq Corporation, Ladas & Larry, September 20, 2005: US06947295 (40 worldwide citation)

A ball grid array package includes a chip having a substrate with a bottom surface, a plurality of solder bumps projecting outwardly from the bottom surface of the substrate, and an electromagnetic shield including a housing that defines an inner space which receives the chip and the solder bumps th ...


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Ki Hyun Ko, Kwang Seop Kim: Memory module. Samsung Electronics, Marger Johnson & McCollom P C, May 10, 2005: US06891729 (38 worldwide citation)

A memory module preferably includes a printed circuit board (PCB) panel having multiple memory chip pad groups arranged on both sides thereof. Each memory chip pad group preferably includes multiple pads that correspond to lead lines of multiple memory chips arranged on the PCB panel. Connectors are ...


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Clas G Sivertsen: Housing for in-line video, keyboard and mouse remote management unit. American Megatrends, Merchant & Gould, May 17, 2005: US06894906 (27 worldwide citation)

Methods and devices provide for remote management of a local computer utilizing a compact, portable interaction device for external connection to a local computer and a network. The interaction device includes a thermally conductive housing with circuit boards disposed within. At least one heat-gene ...


9
Sam Ziqun Zhao, Reza ur Rahman Khan, Imtiaz Chaudhry: Enhanced die-up ball grid array package with two substrates. Broadcom Corporation, Sterne Kessler Goldstein & Fox P L L C, April 5, 2005: US06876553 (27 worldwide citation)

An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second subs ...


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Sreenath Mambakkam, Arockiyaswamy Venkidu, Larry Lawson Jones, Simaly Phoukong: Smartuniversal flash media card adapters. OnSpec Electronic, Blakely Sokoloff Taylor Zafman, February 22, 2005: US06859369 (24 worldwide citation)

A multi-memory media adapter comprised of a first planar element having an upper surface and a lower surface, a second planar element having an upper surface and a lower surface, and a spacer disposed between them. The two planar elements form a port capable of receiving a memory media card. The ada ...