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Belgacem Haba Belgacem (Bel) Haba
Joseph C Fjelstad, Belgacem Haba, Para K Segaram: Signal transmission structure with an air dielectric. Shemwell Gregory & Courtney, November 20, 2003: US20030214802-A1

The dielectric constant and loss tangent of a signal transmission structure is lowered by locating discrete conductors used for signal transmission between two shields so as to form cavities between the discrete conductors and each of the shields. Each cavity is filled with any of a number and/or co ...


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Daniel R Doiron, Gregory S Graham, John Brian Dunn, A Charles Lytle, Brian K Dalton: Uniform illuminator for phototherapy. PDT Systems, Michael G Petit, December 16, 1997: US05698866 (205 worldwide citation)

A light delivery device including an interchangeable handpiece and a semiconductor light source module adapted to releasably attach to the handpiece. The light source module includes a two-dimensional array of light emitting diodes (LED's) disposed on a surface of a fluid-cooled electrically conduct ...


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Paul T Lin: Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery. Motorola, Patricia S Goddard, November 2, 1993: US05258648 (203 worldwide citation)

A composite flip chip semiconductor device (10) permits burn-in testing and rework to be performed on the device while also enhancing electrical, thermal, and mechanical device performance. The device includes a semiconductor die (12) having a plurality of bonding pads (14). Also included in the com ...


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Patrick Brickley, Larry Gonier, James Dewey, Karl H Pohl: Wire distribution apparatus. ADC Telecommunications, Merchant Gould Smith Edell Welter & Schmidt, May 24, 1988: US04747020 (203 worldwide citation)

A wire distribution apparatus is disclosed having a frame member with walls defining a vertical open face chamber. A plurality of termination modules are secured to the frame in side-by-side relation. Each of the modules includes a pair of opposing panels having one end pivotally mounted to the fram ...


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George Jay Lichtblau: A multi-frequency resonant tag circuit for use with an electronic security system having improved noise discrimination. Weingarten Maxham & Schurgin, June 29, 1976: US03967161 (173 worldwide citation)

An electronic security system adapted for use in a controlled area such as a retail store and employing a multi-frequency resonant tag circuit having distinct frequencies for detection and discrimination. An electromagnetic field is provided within the controlled area at a frequency which is swept t ...


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G Mark Berhold: Three-dimensional circuit component assembly and method corresponding thereto. Workman Nydegger & Jensen, May 23, 1989: US04833568 (160 worldwide citation)

A plurality of plate-like circuit component carrier packages having the same size and shape are stacked adjacent one to another with the flat faces thereof in contact to form a carrier package assembly in the form of a prismatic or cylindrically solid. Each carrier package houses one or more electri ...


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Akira Konishi, Teruo Wakano: Semiconductor device and its manufacture. Dai Ichi Seiko, Robbins & Laramie, April 18, 1989: US04823234 (155 worldwide citation)

A semiconductor device of the kind wherein one or more semiconductor chips are housed in a plug-in type package. The package is being molded with a printed wiring substrate, head portions of terminals, and a heat sink for semiconductor chip attachment as an integral part of the package. The one surf ...


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Harold Gregory Hutter: Coaxial electrical connector. Bunker Ramo Corporation, Fred Fisher, F M Arbuckle, February 3, 1976: US03936132 (153 worldwide citation)

This invention relates to a coaxial connector having an injection molded dielectric. The preferred embodiment of the invention is an improved insulated-from-ground panel connector having a onepiece molded body of an insulating material. The molded body has a rear portion shaped to coact with a suita ...


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Katsuo Okuyama, Susumu Arai, Masao Ishiwata, Hirotoshi Takada: Cooling structure of electronic equipment rack. Fujitsu, Staas & Halsey, September 27, 1988: US04774631 (147 worldwide citation)

A cooling structure for an electronic equipment rack which comprises a plurality of shelf units stacked one upon another and arranged in a cabinet, each shelf unit accommodating a plurality of printed circuit boards and having vent holes formed on upper and lower surfaces thereof respectively. A fan ...


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Larry A Speet, Bruce A Rentz, Jan G Wienczkowski: Power receptacle and nested line conditioner arrangement. Steelcase, Price Heneveld Cooper DeWitt & Litton, March 21, 1989: US04814941 (137 worldwide citation)

A power receptacle and nested line conditioner arrangement is provided for office partition systems and the like of the type having electrical power incorporated therein. The arrangement includes a power receptacle having a modular construction with a quick-disconnect that enables the same to be mou ...



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