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Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Flexible lead structures and methods of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 12, 2000: US06117694 (121 worldwide citation)

A microelectronic component, such as a connector or a packaged semiconductor device is made by connecting multiple leads between a pair of elements and moving the elements away from one another so as to bend the leads toward a vertically extensive disposition. One of the elements includes a temporar ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Lidless socket and method of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 14, 1999: US05951305 (106 worldwide citation)

A socket for use with a semiconductor chip assembly having conductive joining units such as solder balls thereon. The socket includes a flexible dielectric element such as a polyimide sheet having a plurality of apertures extending through it. A backing element disposed beneath the dielectric elemen ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz: Multilayer structure with interlocking protrusions. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 13, 2001: US06188028 (28 worldwide citation)

A multilayer structure includes a plurality of stacked circuit panels interconnected by posts extending through each panel. Circuit traces provided on one or both surfaces of each circuit panel interconnect the connectors in a predetermined pattern. The connectors are provided with a blind via which ...


4
Peter C Lord, William P Van Antwerp, John J Mastrototaro, Paul S Cheney II, Nannette M Schnabel: Flex circuit connector. Minimed, Kelly Bauersfeld & Lowry, January 9, 1996: US05482473 (568 worldwide citation)

A connector is provided for electrical connection to a flex circuit in a hermetically sealed manner. The flex circuit comprises thin film conductors encased between layers of insulative material, and including a proximal end with conductive contact pads exposed through one of the insulative layers. ...


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David J Myers: Bioprothesis film strip for surgical stapler and method of attaching the same. Medtronic, Thomas G Berry, Daniel W Latham, March 9, 2004: US06704210 (419 worldwide citation)

A bioprosthesis sealing film strip is attached to a surgical stapler by passing a jaw of the stapler through openings formed in the ends of the strip. Following stapling the strip is released by making a cut from the opening to the edge of the strip. Alternatively, one end of the strip may be releas ...


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Mark S Zifcak, Bruce G Kosa: Electrical circuit board interconnect. Rogers Corporation, December 27, 1988: US04793814 (298 worldwide citation)

A connector arrangement for providing electrical interconnection between coresponding contact pads of opposed first and second circuit boards includes an electrically nonconductive support member disposed between the boards, a bodily-rotatable, electrically conductive interconnect element extending ...


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Igor Y Khandros, Gaetan L Mathieu: Flexible contact structure with an electrically conductive shell. FormFactor, David Larwood, Gerald Linden, June 29, 1999: US05917707 (267 worldwide citation)

An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the f ...


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Stephen C Aldous, Guy M Dake: Systems for connection of physical/electrical media connectors to computer communications cards. Megahertz Corporation, Workman Nydegger & Jensen, February 2, 1993: US05183404 (259 worldwide citation)

A communications card capable of being mounted in electrical communications with a computer has formed therethrough an aperture so sized and shaped as to be capable of receiving a physical/electrical media connector. The media connector has a biased retention clip, a contact pin block, and contact p ...


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Igor Y Khandros, David V Pedersen: Wafer-level burn-in and test. FormFactor, David Larwood, Gerald E Linden, May 16, 2000: US06064213 (218 worldwide citation)

Wafer-level burn-in and test of semiconductor devices under test (DUTs) includes a test substrate having active electronic components (e.g. ASICs) secured to an interconnection substrate, spring contact elements effecting interconnections between the ASICs and the DUTs. This is advantageously perfor ...


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Brain S Beaman, Fuad E Doany, Keith E Fogel, James L Hedrick Jr, Paul A Lauro, Maurice H Norcott, John J Ritsko, Leathen Shi, Da Yuan Shih, George F Walker: Method of forming a three dimensional high performance interconnection package. International Business Machines Corporation, Daniel P Morris, July 2, 1996: US05531022 (212 worldwide citation)

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is fo ...