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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Anthony B Faraci: Method of making a connection to a microelectronic element. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 6, 2002: US06428328 (109 worldwide citation)

A connector for microelectronic elements includes a sheetlike dielectric layer having a plurality of through holes desirably arranged in a rectangular grid pattern. Each hole is provided on one major surface with a generally laminar contact having at least one projection extending inwardly over the ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Lidless socket and method of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 14, 1999: US05951305 (103 worldwide citation)

A socket for use with a semiconductor chip assembly having conductive joining units such as solder balls thereon. The socket includes a flexible dielectric element such as a polyimide sheet having a plurality of apertures extending through it. A backing element disposed beneath the dielectric elemen ...


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Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Flexible lead structures and methods of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 12, 2000: US06117694 (98 worldwide citation)

A microelectronic component, such as a connector or a packaged semiconductor device is made by connecting multiple leads between a pair of elements and moving the elements away from one another so as to bend the leads toward a vertically extensive disposition. One of the elements includes a temporar ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Anthony B Faraci: Low insertion force connector for microelectronic elements. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 13, 2001: US06200143 (90 worldwide citation)

A connector for microelectronic elements includes a sheetlike dielectric layer having a plurality of through holes desirably arranged in a rectangular grid pattern. Each hole is provided on one major surface with a generally laminar contact having at least one projection extending inwardly over the ...


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Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for multi-die wirebond assemblies with parallel windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, January 1, 2013: US08345441 (38 worldwide citation)

A microelectronic assembly can include first and second microelectronic packages mounted to respective first and second opposed surfaces of a circuit panel. Each microelectronic package can include a substrate having first and second apertures extending between first and second surfaces thereof, fir ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz: Multilayer structure with interlocking protrusions. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 13, 2001: US06188028 (26 worldwide citation)

A multilayer structure includes a plurality of stacked circuit panels interconnected by posts extending through each panel. Circuit traces provided on one or both surfaces of each circuit panel interconnect the connectors in a predetermined pattern. The connectors are provided with a blind via which ...


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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba: Microelectronic joining processes with temporary securement. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 8, 2003: US06543131 (23 worldwide citation)

A method of making microelectronic assemblies includes temporarily securing one or more microelectronic elements in place on one or more components using one or more temporary securements extending between the microelectronic elements and components and adhering to the elements and components. Condu ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Multilayer wiring element having pin interface. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 22, 2011: US07911805 (20 worldwide citation)

A method of forming contacts for an interconnection element, includes (a) joining a conductive element to an interconnection element having multiple wiring layers, (b) patterning the conductive element to form conductive pins, and (c) electrically interconnecting the conductive pins with conductive ...


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Belgacem Haba Belgacem (Bel) Haba
Joseph C Fjelstad, Para K Segaram, Belgacem Haba: Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths. Silicon Pipe, Ronald R Shea Esq, December 11, 2007: US07307293 (17 worldwide citation)

A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages suspended above the printed circuit bo ...



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